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參數(shù)資料
型號: DAC8412FPZ
廠商: Analog Devices Inc
文件頁數(shù): 18/20頁
文件大小: 0K
描述: IC DAC 12BIT QUAD W/READBK 28DIP
產(chǎn)品培訓模塊: Data Converter Fundamentals
DAC Architectures
產(chǎn)品變化通告: DAC8412/3 Redesign and Fab Process Change 01/Oct/2009
標準包裝: 13
設(shè)置時間: 6µs
位數(shù): 12
數(shù)據(jù)接口: 并聯(lián)
轉(zhuǎn)換器數(shù)目: 4
電壓電源: 單電源
功率耗散(最大): 330mW
工作溫度: -40°C ~ 85°C
安裝類型: 通孔
封裝/外殼: 28-DIP(0.600",15.24mm)
供應(yīng)商設(shè)備封裝: 28-PDIP
包裝: 管件
輸出數(shù)目和類型: 4 電壓,單極;4 電壓,雙極
采樣率(每秒): 167k
Data Sheet
DAC8412/DAC8413
Rev. G | Page 7 of 20
ABSOLUTE MAXIMUM RATINGS
TA = +25°C, unless otherwise noted.
Table 3.
Parameter
Rating
VSS to VDD
0.3 V, +33.0 V
VSS to VLOGIC
0.3 V, +33.0 V
VLOGIC to DGND
0.3 V, +7.0 V
VSS to VREFL
0.3 V, +VSS 2.0 V
VREFH to VDD
+2.0 V, +33.0 V
VREFH to VREFL
+2.0 V, VSS VDD
Current into Any VSS pin
±15 mA
Digital Input Voltage to DGND
0.3 V, VLOGIC + 0.3 V
Digital Output Voltage to DGND
0.3 V, +7.0 V
Operating Temperature Range
EP, FP, FPC
40°C to +85°C
AT, BT, BTC
55°C to +125°C
Junction Temperature
150°C
Storage Temperature Range
65°C to +150°C
Power Dissipation Package
1000 mW
Lead Temperature
JEDEC Industry Standard
Soldering
J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case mounting conditions, that is, a
device in socket.
Table 4. Thermal Resistance
Package Type
θJA
θJC
Unit
28-Lead Plastic DIP (PDIP)
48
22
°C/W
28-Terminal Ceramic Leadless Chip Carrier (LLC)
70
28
°C/W
28-Lead Plastic Leaded Chip Carrier (PLLC)
63
25
°C/W
28-Lead Ceramic Dual In-Line Package (CERDIP)
51
9
°C/W
ESD CAUTION
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