參數(shù)資料
型號(hào): DC1786A
廠商: Linear Technology
文件頁數(shù): 28/36頁
文件大小: 0K
描述: BOARD DEMO LTC2871
設(shè)計(jì)資源: DC1786A Design Files
DC1786A Schematic
標(biāo)準(zhǔn)包裝: 1
主要目的: 接口,收發(fā)器,RS-232/RS-485
嵌入式:
已用 IC / 零件: LTC2871
主要屬性: 3 個(gè)驅(qū)動(dòng)器,3 個(gè)接收器
次要屬性: 3 V ~ 5.5 V 電源
已供物品:
相關(guān)產(chǎn)品: LTC2871CUHF#PBF-ND - IC TXRX RS485/RS422 38-QFN
LTC2871IUHF#PBF-ND - IC TXRX RS485/RS422 38-QFN
LTC2871CFE#PBF-ND - IC TXRX RS485/RS422 38-TSSOP
LTC2871IFE#PBF-ND - IC TXRX RS485/RS422 38-TSSOP
LTC2871CUHF#TRPBF-ND - IC TXRX RS485/RS422 38-QFN
LTC2871IFE#TRPBF-ND - IC TXRX RS485/RS422 38-TSSOP
LTC2871IUHF#TRPBF-ND - IC TXRX RS485/RS422 38-QFN
LTC2871CFE#TRPBF-ND - IC TXRX RS485/RS422 38-TSSOP
LTC2870/LTC2871
34
28701f
PACKAGE DESCRIPTION
UFD Package
28-Lead Plastic QFN (4mm × 5mm)
(Reference LTC DWG # 05-08-1712 Rev B)
4.00 ± 0.10
(2 SIDES)
2.50 REF
5.00 ± 0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 ± 0.10
27
28
1
2
BOTTOM VIEW—EXPOSED PAD
3.50 REF
0.75 ± 0.05
R = 0.115
TYP
R = 0.05
TYP
PIN 1 NOTCH
R = 0.20 OR 0.35
× 45° CHAMFER
0.25 ± 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UFD28) QFN 0506 REV B
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70 ±0.05
0.25 ±0.05
0.50 BSC
2.50 REF
3.50 REF
4.10 ± 0.05
5.50 ± 0.05
2.65 ± 0.05
3.10 ± 0.05
4.50 ± 0.05
PACKAGE OUTLINE
2.65 ± 0.10
3.65 ± 0.10
3.65 ± 0.05
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