參數(shù)資料
型號: DE275X2-501N16A
廠商: IXYS CORP
元件分類: 功率晶體管
英文描述: RF Power MOSFET
中文描述: 2 CHANNEL, VHF BAND, Si, N-CHANNEL, RF POWER, MOSFET
封裝: D3, 8 PIN
文件頁數(shù): 1/3頁
文件大?。?/td> 78K
代理商: DE275X2-501N16A
DE275X2-501N16A
RF Power MOSFET
Directed Energy, Inc.
IXYS
Company
An
Preliminary Data Sheet
V
DSS
I
D25
R
DS(on)
P
DHS
=
=
=
=
500 V
16 A
0.5
750 W
Symbol
Test Conditions
Maximum Ratings
V
DSS
T
J
= 25°C to 150°C
500
V
V
DGR
T
J
= 25°C to 150°C; R
GS
= 1 M
500
V
V
GS
Continuous
±20
V
V
GSM
Transient
±30
V
I
D25
T
c
= 25°C
16
A
I
DM
T
c
= 25°C, pulse width limited by T
JM
96
A
I
AR
T
c
= 25°C
16
A
E
AR
T
c
= 25°C
20
mJ
I
S
I
DM
, di/dt
100A/
μ
s, V
DD
V
DSS
,
T
j
150°C, R
G
= 0.2
5 V/ns
I
S
= 0
>200 V/ns
P
DHS
(1)
T
c
= 25°C, Derate 6.0W/°C above 25°C
750
W
P
DAMB
(1)
T
c
= 25°C
5.0
W
T
J
-55…+150
°C
T
JM
150
°C
T
stg
-55…+150
°C
T
L
1.6mm (0.063 in) from case for 10 s
300
°C
Weight
4
g
dv/dt
R
thJHS
(1)
0.17
K/W
Symbol
Test Conditions
Characteristic Values
T
J
= 25°C unless otherwise specified
min.
typ.
max.
V
DSS
V
GS
= 0 V, I
D
= 3 ma
500
V
V
GS(th)
V
DS
= V
GS
, I
D
= 4 ma
2.5
5.5
V
I
GSS
V
GS
= ±20 V
DC
, V
DS
= 0
±100 nA
I
DSS
V
DS
= 0.8 V
DSS
T
J
= 25°C
V
GS
= 0 T
J
= 125°C
50
1
μ
A
mA
R
DS(on)
0.5
g
fs
V
DS
= 15 V, I
D
= 0.5I
D25
, pulse test
2
6
S
V
GS
= 15 V, I
D
= 0.5I
D25
Pulse test, t
300
μ
S, duty cycle d
2%
Features
Isolated Substrate
high isolation voltage (>2500V)
excellent thermal transfer
Increased temperature and power
cycling capability
IXYS advanced low Q
g
process
Low gate charge and capacitances
easier to drive
faster switching
Low R
DS(on)
Very low insertion inductance (<2nH)
No beryllium oxide (BeO) or other
hazardous materials
Advantages
High Performance Push-Pull RF
Package
Optimized for RF and high speed
switching at frequencies to >65MHz
Easy to mount—no insulators needed
High power density
Common Source Push-Pull Pair
N-Channel Enhancement Mode
Low Q
g
and R
g
High dv/dt
Nanosecond Switching
DRAIN 1
SG1
SD1
GATE 1
DRAIN 2
SG2
SD2
GATE 2
The DE275X2-501N16A is a matched pair of RF power MOSFET devices in
a common source configuration. The device is optimized for push-pull or
parallel operation in RF generators and amplifiers at frequencies to >65
MHz.
Note: All specifications are per each tran-
sistor, unless otherwise noted.
(1)
Thermal specifications are for the
package, not per transistor
Unless noted, specifications are for each output device
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