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參數(shù)資料
| 型號： | DF3067RF20V |
| 廠商： | Renesas Electronics America |
| 文件頁數(shù)： | 12/46頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC H8/3067 MCU FLASH 128K 100QFP |
| 產(chǎn)品培訓模塊： | Electromagnetic Noise Reduction Techniques Part 1 Digital to Analog Converter Part 1 Digital to Analog Converter Part 2 |
| 標準包裝： | 1 |
| 系列： | H8® H8/300H |
| 核心處理器： | H8/300H |
| 芯體尺寸： | 16-位 |
| 速度： | 20MHz |
| 連通性： | SCI，智能卡 |
| 外圍設備： | DMA，PWM，WDT |
| 輸入/輸出數(shù)： | 70 |
| 程序存儲器容量： | 128KB（128K x 8） |
| 程序存儲器類型： | 閃存 |
| RAM 容量： | 4K x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 4.5 V ~ 5.5 V |
| 數(shù)據(jù)轉換器： | A/D 8x10b; D/A 2x8b |
| 振蕩器型： | 內(nèi)部 |
| 工作溫度： | -20°C ~ 75°C |
| 封裝/外殼： | 100-BFQFP |
| 包裝： | 托盤 |
| 產(chǎn)品目錄頁面： | 742 (CN2011-ZH PDF) |
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In 2005, Renesas earned
a 23% share of the global
MCU market — more
than any other supplier —
and an 11% market share in
the Americas (a 12% increase),
according to Gartner
Semiconductor Industry
Worldwide Annual
Market Share Database,
March 31, 2006
RENESAS
ACHIEVED
12%
MARKET SHARE
GROWTH IN THE
AMERICAS IN 2005!
RENESAS IS
#1
WORLDWIDE
IN MCU
SHIPMENTS
IMPORTANT!
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H8 Family of Microcontrollers
2006 Catalog
Renesas Technology America
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| DF3067RF20VTR | 功能描述:MCU 3/5V 128K PB-FREE 100-QFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8/300H 產(chǎn)品培訓模塊:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 標準包裝:1 系列:M16C™ M32C/80/87 核心處理器:M32C/80 芯體尺寸:16/32-位 速度:32MHz 連通性:EBI/EMI，I²C，IEBus，IrDA，SIO，UART/USART 外圍設備:DMA，POR，PWM，WDT 輸入/輸出數(shù):121 程序存儲器容量:384KB（384K x 8） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:24K x 8 電壓 - 電源 (Vcc/Vdd):3 V ~ 5.5 V 數(shù)據(jù)轉換器:A/D 34x10b，D/A 2x8b 振蕩器型:內(nèi)部 工作溫度:-20°C ~ 85°C 封裝/外殼:144-LQFP 包裝:托盤 產(chǎn)品目錄頁面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87 |
| DF3067RVF13V | 功能描述:MCU 3/5V 128K,PB-FREE 100-QFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8/300H 標準包裝:160 系列:S08 核心處理器:S08 芯體尺寸:8-位 速度:40MHz 連通性:I²C，LIN，SCI，SPI 外圍設備:LCD，LVD，POR，PWM，WDT 輸入/輸出數(shù):53 程序存儲器容量:32KB（32K x 8） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:1.9K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉換器:A/D 12x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 105°C 封裝/外殼:64-LQFP 包裝:托盤 |
| DF3067RVFI13V | 功能描述:MCU 3/5V 128K 100-QFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8/300H 標準包裝:160 系列:S08 核心處理器:S08 芯體尺寸:8-位 速度:40MHz 連通性:I²C，LIN，SCI，SPI 外圍設備:LCD，LVD，POR，PWM，WDT 輸入/輸出數(shù):53 程序存儲器容量:32KB（32K x 8） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:1.9K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉換器:A/D 12x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 105°C 封裝/外殼:64-LQFP 包裝:托盤 |
| DF3067RVX13V | 功能描述:MCU 3/5V 128K 100-QFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8/300H 標準包裝:160 系列:S08 核心處理器:S08 芯體尺寸:8-位 速度:40MHz 連通性:I²C，LIN，SCI，SPI 外圍設備:LCD，LVD，POR，PWM，WDT 輸入/輸出數(shù):53 程序存儲器容量:32KB（32K x 8） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:1.9K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉換器:A/D 12x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 105°C 封裝/外殼:64-LQFP 包裝:托盤 |
| DF3068F25V | 功能描述:IC H8/3068F MCU FLASH 100QFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8/300H 產(chǎn)品培訓模塊:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 標準包裝:1 系列:M16C™ M32C/80/87 核心處理器:M32C/80 芯體尺寸:16/32-位 速度:32MHz 連通性:EBI/EMI，I²C，IEBus，IrDA，SIO，UART/USART 外圍設備:DMA，POR，PWM，WDT 輸入/輸出數(shù):121 程序存儲器容量:384KB（384K x 8） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:24K x 8 電壓 - 電源 (Vcc/Vdd):3 V ~ 5.5 V 數(shù)據(jù)轉換器:A/D 34x10b，D/A 2x8b 振蕩器型:內(nèi)部 工作溫度:-20°C ~ 85°C 封裝/外殼:144-LQFP 包裝:托盤 產(chǎn)品目錄頁面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87 |
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