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參數(shù)資料
| 型號： | DG2718DN-T1-E4 |
| 廠商： | Vishay Siliconix |
| 文件頁數(shù)： | 2/7頁 |
| 文件大小： | 0K |
| 描述： | IC SWITCH DUAL DPDT 16QFN |
| 標準包裝： | 2,500 |
| 功能： | 開關(guān) |
| 電路： | 2 x DPDT - NC/NO |
| 導(dǎo)通狀態(tài)電阻： | 600 毫歐 |
| 電壓電源： | 單電源 |
| 電壓 - 電源，單路/雙路(±)： | 1.65 V ~ 3.6 V |
| 電流 - 電源： | 1µA |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-VFQFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 16-QFN（3x3） |
| 包裝： | 帶卷 (TR) |
DG2718
Vishay Siliconix
New Product
www.vishay.com
2
Document Number: 72677
S–52186—Rev. B, 17-Oct-05
ABSOLUTE MAXIMUM RATINGS
Reference to GND
V+
-0.3 to +4.0 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
IN, COM, NC, NOa
-0.3 to (V+ + 0.3 V)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Current (Any terminal except NO, NC or COM)
30 mA
. . . . . . . . . . . . . . . . . .
Continuous Current (NO, NC, or COM)
"300 mA
. . . . . . . . . . . . . . . . . . . . .
Peak Current
"500 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(Pulsed at 1 ms, 10% duty cycle)
Storage Temperature (D Suffix)
-65 to 150
°C
. . . . . . . . . . . . . . . . . . . . . . . . . .
Package Solder Reflow Conditionsd
16-Pin QFN (3 x 3 mm)
250
°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Dissipation (Packages)b
QFN-16c
1385 mW
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Notes:
a.
Signals on NC, NO, or COM or IN exceeding V+ will be clamped by
internal diodes. Limit forward diode current to maximum current ratings.
b.
All leads welded or soldered to PC Board.
c.
Derate 17.3 mW/
_C above 70_C
d.
Manual soldering with iron is not recommended for leadless components.
The QFN is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in
manufacturing. A solder fillet at the exposed copper lip cannot be
guaranteed and is not required to ensure adequate bottom side solder
interconnection.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
SPECIFICATIONS (V+ = 1.8 V)
Test Conditions
Otherwise Unless Specified
Limits
–40 to 85
_C
Parameter
Symbol
V+ = 1.8 V, VIN = 0.4 or 1.1 Ve
Tempa
Minb
Typc
Maxb
Unit
Analog Switch
Analog Signal Ranged
VNO, VNC,
VCOM
Full
0
V+
V
On-Resistanced
rON
V+ = 1.8 V, VCOM = 0.2 V/0.9 V, INO, INC = 100 mA
Room
Full
0.7
2.0
2.8
W
Digital Control
Input High Voltage
VINH
Full
1.1
V
Input Low Voltage
VINL
Full
0.4
V
Input Capacitance
Cin
Full
6
pF
Input Current
IINL or IINH
VIN = 0 or V+
Full
–1
1
mA
Dynamic Characteristics
Turn-On Time
tON
Room
Full
62
94
92
Turn-Off Time
tOFF
VNO or VNC = 1.5 V, RL = 50 W, CL = 35 pF
Room
Full
24
52
55
ns
Break-Before-Make Time
td
Full
16
Charge Injectiond
QINJ
CL = 1 nF, VGEN = 0 V, RGEN = 0 W
Room
65
pC
Off-Isolationd
OIRR
RL =50 W CL = 5 pF f = 100 kHz
Room
–74
dB
Crosstalkd
XTALK
RL = 50 W, CL = 5 pF, f = 100 kHz
Room
–74
dB
NO NC Off Capacitanced
CNO(off)
Room
108
NO, NC Off Capacitanced
CNC(off)
VIN =0orV+ f=1MHz
Room
108
pF
Channel On Capacitanced
CNO(on)
VIN = 0 or V+, f = 1 MHz
Room
225
pF
Channel-On Capacitanced
CNC(on)
Room
225
Power Supply
Power Supply Current
I+
VIN = 0 or V+
Full
1.0
mA
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