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參數(shù)資料
| 型號(hào)： | DG3517DB-T5-E1 |
| 廠商： | Vishay Siliconix |
| 文件頁(yè)數(shù)： | 11/11頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC SWITCH DUAL SPDT 10MICRO |
| 標(biāo)準(zhǔn)包裝： | 3,000 |
| 功能： | 開(kāi)關(guān) |
| 電路： | 2 x SPDT - NC/NO |
| 導(dǎo)通狀態(tài)電阻： | 2.9 歐姆 |
| 電壓電源： | 單電源 |
| 電壓 - 電源，單路/雙路(±)： | 1.8 V ~ 5.5 V |
| 電流 - 電源： | 1µA |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類(lèi)型： | 表面貼裝 |
| 封裝/外殼： | 10-WFBGA |
| 供應(yīng)商設(shè)備封裝： | 10-Micro Foot?（4x3） |
| 包裝： | 帶卷 (TR) |
Document Number: 73404
S11-1185-Rev. D, 13-Jun-11
www.vishay.com
9
Vishay Siliconix
DG3516, DG3517
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Product is End of Life
PACKAGE OUTLINE
MICRO FOOT: 10 BUMP (4 x 3 0.5 mm PITCH, 0.238 mm BUMP HEIGHT)
Notes (Unless Otherwise Specified):
a. Bump is Lead (Pb)-free Sn/Ag/Cu.
b. Non-solder mask defined copper landing pad.
c. Laser Mark on silicon die back; back-lapped, no coating. Shown is not actual marking; sample only.
Notes:
a. Use millimeters as the primary measurement.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?73404.
Index-Bump A1
Note c
Top Side (Die Back)
XXX
3516
Recommended Land Pattern
0.5
10 X 0.150
0.229
Note b
Solder Mask
Pad Diameter + 0.1
Bump
Note a
32
1
A
B
e
D
A
A2
A1
S
E
Silicon
C
4
b Diameter
e
Dim.
Millimetersa
Inches
Min.
Max.
Min.
Max.
A
0.688
0.753
0.0271
0.0296
A1
0.218
0.258
0.0086
0.0102
A2
0.470
0.495
0.0185
0.0195
b
0.306
0.346
0.0120
0.0136
D
1.980
2.020
0.0780
0.0795
E
1.480
1.520
0.0583
0.0598
e
0.5 BASIC
0.0197 BASIC
S
0.230
0.270
0.0091
0.0106
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