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參數(shù)資料
| 型號： | DIM200PHM33-F |
| 英文描述： | IGBT Modules - Half Bridge |
| 中文描述： | IGBT模塊-半橋 |
| 文件頁數(shù)： | 3/9頁 |
| 文件大?。?/td> | 168K |
| 代理商： | DIM200PHM33-F |
DIM200BSS12-A000
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
www.dynexsemi.com
3/9
Test Conditions
Continuous dissipation -
junction to case
Continuous dissipation -
junction to case
Mounting torque 5Nm
(with mounting grease)
Transistor
Diode
-
Mounting - M6
Electrical connections - M6
Electrical connections - M6
Parameter
Thermal resistance - transistor
Thermal resistance - diode
Thermal resistance - case to heatsink
(per module)
Junction temperature
Storage temperature range
Screw torque
THERMAL AND MECHANICAL RATINGS
Internal insulation:
Baseplate material:
Creepage distance:
Al
2
O
3
Cu
20mm
Clearance:
CTI (Critical Tracking Index):
11mm
425
Symbol
R
th(j-c)
R
th(j-c)
R
th(c-h)
T
j
T
stg
-
Units
C/kW
C/kW
C/kW
C
C
C
Nm
Nm
Nm
Max.
90
194
15
150
125
125
5
5
2
Typ.
-
-
-
-
-
-
-
-
-
Min.
-
-
-
-
-
–40
3
2.5
1.1
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DIM200PHM33F000 | 制造商:Dynex Semiconductor 功能描述:POWER IGBT TRANSISTOR |
| DIM200PHM33-F000 | 制造商:DYNEX 制造商全稱:Dynex Semiconductor 功能描述:Half Bridge IGBT Module |
| DIM200PHM33-F000_11 | 制造商:DYNEX 制造商全稱:Dynex Semiconductor 功能描述:Half Bridge IGBT Module |
| DIM200PKM33 | 制造商:DYNEX 制造商全稱:Dynex Semiconductor 功能描述:深圳鵬電致遠(yuǎn)電子有限公司 |
| DIM200PKM33-A | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:IGBT Modules - Chopper |
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