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參數(shù)資料
| 型號(hào)： | DIM200PHM33-F |
| 英文描述： | IGBT Modules - Half Bridge |
| 中文描述： | IGBT模塊-半橋 |
| 文件頁(yè)數(shù)： | 4/9頁(yè) |
| 文件大?。?/td> | 168K |
| 代理商： | DIM200PHM33-F |
DIM200BSS12-A000
4/9
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
www.dynexsemi.com
Test Conditions
V
GE
= 0V, V
CE
= V
CES
V
GE
= 0V, V
CE
= V
CES
, T
case
= 125C
V
GE
=
±
20V, V
CE
= 0V
I
C
= 10mA, V
GE
= V
CE
V
GE
= 15V, I
C
= 200A
V
GE
= 15V, I
C
= 200A, , T
case
= 125C
DC
t
p
= 1ms
I
F
= 200A
I
F
= 200A, T
case
= 125C
V
CE
= 25V, V
GE
= 0V, f = 1MHz
-
-
T
j
= 125C, V
CC
= 900V,
I
1
t
p
≤
10
μ
s,
V
CE(max)
= V
CES
– L*. di/dt
I
2
IEC 60747-9
Parameter
Collector cut-off current
Gate leakage current
Gate threshold voltage
Collector-emitter saturation voltage
Diode forward current
Diode maximum forward current
Diode forward voltage
Input capacitance
Module inductance
Internal transistor resistance
Short circuit. I
SC
ELECTRICAL CHARACTERISTICS
T
case
= 25C unless stated otherwise.
Symbol
I
CES
I
GES
V
GE(TH)
V
CE(sat)
I
F
I
FM
V
F
C
ies
L
M
R
INT
SC
Data
Units
mA
mA
μ
A
V
V
V
A
A
V
V
nF
nH
m
A
A
Max.
0.25
6
1
6.5
2.7
3.1
200
400
2.4
2.4
-
-
-
-
-
Typ.
-
-
-
5.5
2.2
2.6
-
-
2.1
2.1
33
20
0.23
1375
1125
Min.
-
-
-
4.5
-
-
-
-
-
-
-
-
-
-
-
Note:
Measured at the power busbars and not the auxiliary terminals)
L* is the circuit inductance + L
M
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
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| DIM200PHM33-F000 | 制造商:DYNEX 制造商全稱(chēng):Dynex Semiconductor 功能描述:Half Bridge IGBT Module |
| DIM200PHM33-F000_11 | 制造商:DYNEX 制造商全稱(chēng):Dynex Semiconductor 功能描述:Half Bridge IGBT Module |
| DIM200PKM33 | 制造商:DYNEX 制造商全稱(chēng):Dynex Semiconductor 功能描述:深圳鵬電致遠(yuǎn)電子有限公司 |
| DIM200PKM33-A | 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:IGBT Modules - Chopper |
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