參數(shù)資料
型號(hào): DIM200WHS17-E
英文描述: IGBT Modules - Half Bridge
中文描述: IGBT模塊-半橋
文件頁(yè)數(shù): 3/9頁(yè)
文件大?。?/td> 168K
代理商: DIM200WHS17-E
DIM200BSS12-A000
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
www.dynexsemi.com
3/9
Test Conditions
Continuous dissipation -
junction to case
Continuous dissipation -
junction to case
Mounting torque 5Nm
(with mounting grease)
Transistor
Diode
-
Mounting - M6
Electrical connections - M6
Electrical connections - M6
Parameter
Thermal resistance - transistor
Thermal resistance - diode
Thermal resistance - case to heatsink
(per module)
Junction temperature
Storage temperature range
Screw torque
THERMAL AND MECHANICAL RATINGS
Internal insulation:
Baseplate material:
Creepage distance:
Al
2
O
3
Cu
20mm
Clearance:
CTI (Critical Tracking Index):
11mm
425
Symbol
R
th(j-c)
R
th(j-c)
R
th(c-h)
T
j
T
stg
-
Units
C/kW
C/kW
C/kW
C
C
C
Nm
Nm
Nm
Max.
90
194
15
150
125
125
5
5
2
Typ.
-
-
-
-
-
-
-
-
-
Min.
-
-
-
-
-
–40
3
2.5
1.1
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