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參數(shù)資料
| 型號(hào)： | DS10BR254TSQ/NOPB |
| 廠(chǎng)商： | National Semiconductor |
| 文件頁(yè)數(shù)： | 4/16頁(yè) |
| 文件大小： | 0K |
| 描述： | IC LVDS REPEAT 1.5GBPS 1:4 40LLP |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 類(lèi)型： | 轉(zhuǎn)發(fā)器 |
| Tx/Rx類(lèi)型： | LVDS |
| 延遲時(shí)間： | 440ps |
| 電容 - 輸入： | 1.7pF |
| 電源電壓： | 3 V ~ 3.6 V |
| 電流 - 電源： | 135mA |
| 安裝類(lèi)型： | 表面貼裝 |
| 封裝/外殼： | 40-WFQFN 裸露焊盤(pán) |
| 供應(yīng)商設(shè)備封裝： | 40-LLP-EP（6x6） |
| 包裝： | 標(biāo)準(zhǔn)包裝 |
| 產(chǎn)品目錄頁(yè)面： | 1275 (CN2011-ZH PDF) |
| 其它名稱(chēng)： | DS10BR254TSQDKR |
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PACKAGE OPTION ADDENDUM
www.ti.com
12-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
Op Temp (°C)
Top-Side Markings
(4)
Samples
DS10BR254TSQ/NOPB
ACTIVE
WQFN
RTA
40
250
Green (RoHS
& no Sb/Br)
SN
Level-3-260C-168 HR
-40 to 85
1BR254SQ
DS10BR254TSQX/NOPB
ACTIVE
WQFN
RTA
40
2500
Green (RoHS
& no Sb/Br)
SN
Level-3-260C-168 HR
-40 to 85
1BR254SQ
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DS10BR254TSQX/NOPB | 功能描述:接口 - 專(zhuān)用 RoHS:否 制造商:Texas Instruments 產(chǎn)品類(lèi)型:1080p60 Image Sensor Receiver 工作電源電壓:1.8 V 電源電流:89 mA 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:BGA-59 |
| DS10CP152EVK/NOPB | 功能描述:其他開(kāi)發(fā)工具 1.5 GBPS 2X2 CROSSPOINT EVK RoHS:否 制造商:Parallax 產(chǎn)品:ELEV-8 Hex Upgrade Kits 類(lèi)型:Robotics 工具用于評(píng)估:ELEV-8 Quadcopter 工作電源電壓: |
| DS10CP152QMA/NOPB | 功能描述:模擬和數(shù)字交叉點(diǎn) IC RoHS:否 制造商:Micrel 配置:2 x 2 封裝 / 箱體:MLF-16 數(shù)據(jù)速率:10.7 Gbps 輸入電平:CML, LVDS, LVPECL 輸出電平:CML 電源電壓-最大:3.6 V 電源電壓-最小:2.375 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 產(chǎn)品:Digital Crosspoint 封裝:Tube |
| DS10CP152QMAX/NOPB | 功能描述:模擬和數(shù)字交叉點(diǎn) IC RoHS:否 制造商:Micrel 配置:2 x 2 封裝 / 箱體:MLF-16 數(shù)據(jù)速率:10.7 Gbps 輸入電平:CML, LVDS, LVPECL 輸出電平:CML 電源電壓-最大:3.6 V 電源電壓-最小:2.375 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 產(chǎn)品:Digital Crosspoint 封裝:Tube |
| DS10CP152TMA/NOPB | 功能描述:模擬和數(shù)字交叉點(diǎn) IC RoHS:否 制造商:Micrel 配置:2 x 2 封裝 / 箱體:MLF-16 數(shù)據(jù)速率:10.7 Gbps 輸入電平:CML, LVDS, LVPECL 輸出電平:CML 電源電壓-最大:3.6 V 電源電壓-最小:2.375 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 產(chǎn)品:Digital Crosspoint 封裝:Tube |
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