參數(shù)資料
型號： DSPIC30F3013-30I/ML
廠商： Microchip Technology
文件頁數(shù)： 111/161頁
文件大小： 0K
描述： IC DSPIC MCU/DSP 24K 44QFN
產(chǎn)品培訓模塊： Serial Communications using dsPIC30F I2C
Serial Communications using dsPIC30F SPI
Serial Communications using dsPIC30F UART
dsPIC30F 12 bit ADC - Part 2
dsPIC30F Addressing Modes - Part 1
dsPIC30F Architecture - Part 1
dsPIC30F DSP Engine & ALU
dsPIC30F Interrupts
dsPIC30F Motor Control PWM
dsPIC Timers
Asynchronous Stimulus
dsPIC30F Addressing Modes - Part 2
dsPIC30F Architecture - Part 2
dsPIC30F 12-bit ADC Part 1
標準包裝： 45
系列： dsPIC™ 30F
核心處理器： dsPIC
芯體尺寸： 16-位
速度： 30 MIP
連通性： I²C，SPI，UART/USART
外圍設備： 欠壓檢測/復位，POR，PWM，WDT
輸入/輸出數(shù)： 20
程序存儲器容量： 24KB（8K x 24）
程序存儲器類型： 閃存
EEPROM 大?。?/td> 1K x 8
RAM 容量： 2K x 8
電壓 - 電源 (Vcc/Vdd)： 2.5 V ~ 5.5 V
數(shù)據(jù)轉換器： A/D 10x12b
振蕩器型： 內(nèi)部
工作溫度： -40°C ~ 85°C
封裝/外殼： 44-VQFN 裸露焊盤
包裝： 管件
產(chǎn)品目錄頁面： 651 (CN2011-ZH PDF)
配用： DV164033-ND - KIT START EXPLORER 16 MPLAB ICD2
DM240001-ND - BOARD DEMO PIC24/DSPIC33/PIC32
DV164005-ND - KIT ICD2 SIMPLE SUIT W/USB CABLE
其它名稱： DSPIC30F301330IML
2010 Microchip Technology Inc.
DS70139G-page 39
dsPIC30F2011/2012/3012/3013
All byte loads into any W register are loaded into the
LSB. The MSB is not modified.
A Sign-Extend (SE) instruction is provided to allow
users to translate 8-bit signed data to 16-bit signed
values. Alternatively, for 16-bit unsigned data, users
can clear the MSB of any W register by executing a
Zero-Extend (ZE) instruction on the appropriate
address.
Although most instructions are capable of operating on
word or byte data sizes, it should be noted that some
instructions, including the DSP instructions, operate
only on words.
3.2.5
NEAR DATA SPACE
An 8 Kbyte near data space is reserved in X address
memory space between 0x0000 and 0x1FFF, which is
directly addressable via a 13-bit absolute address field
within all memory direct instructions. The remaining X
address space and all of the Y address space is
addressable indirectly. Additionally, the whole of X data
space is addressable using MOV instructions, which
support memory direct addressing with a 16-bit
address field.
3.2.6
SOFTWARE STACK
The dsPIC DSC devices contain a software stack. W15
is used as the Stack Pointer.
The Stack Pointer always points to the first available
free word and grows from lower addresses towards
higher addresses. It pre-decrements for stack pops
and post-increments for stack pushes, as shown in
Figure 3-10. Note that for a PC push during any CALL
instruction, the MSB of the PC is zero-extended before
the push, ensuring that the MSB is always clear.
FIGURE 3-10:
CALL
STACK FRAME
There is a Stack Pointer Limit register (SPLIM)
associated
with
the
Stack
Pointer.
SPLIM
is
uninitialized at Reset. As is the case for the Stack
Pointer, SPLIM<0> is forced to ‘0’ because all stack
operations must be word aligned. Whenever an
Effective Address (EA) is generated using W15 as a
source or destination pointer, the address thus
generated is compared with the value in SPLIM. If the
contents of the Stack Pointer (W15) and the SPLIM reg-
ister are equal, and a push operation is performed, a
stack error trap does not occur. The stack error trap
occurs on a subsequent push operation. Thus, for
example, if it is desirable to cause a stack error trap
when the stack grows beyond address 0x2000 in RAM,
initialize the SPLIM with the value, 0x1FFE.
Similarly, a Stack Pointer underflow (stack error) trap is
generated when the Stack Pointer address is found to
be less than 0x0800, thus preventing the stack from
interfering with the Special Function Register (SFR)
space.
A write to the SPLIM register should not be immediately
followed by an indirect read operation using W15.
Note:
A PC push during exception processing
concatenates the SRL register to the MSB
of the PC prior to the push.
<Free Word>
PC<15:0>
000000000
0
15
W15 (before CALL)
W15 (after CALL)
S
tac
k
Gr
ow
s
T
o
w
a
rd
s
Hi
gh
er
A
d
re
s
0x0000
PC<22:16>
POP
: [--W15]
PUSH : [W15++]
相關PDF資料
PDF描述
928034-4 96P MOD2 ST-WANNE
223041-1 CONN SHROUD 30POS VERT 2MM
008016090000601 CONN RACK & PANEL MALE 90P
516-090-000-301 CONN RACK & PANEL PLUG 90POS
516-038-000-301 CONN RACK & PANEL PLUG 38POS
相關代理商/技術參數(shù)
參數(shù)描述
dsPIC30F3013T-20E/ML 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 44LD 20MIPS 24 KB RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
dsPIC30F3013T-20E/SO 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 28LD 20MIPS 24 KB RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
dsPIC30F3013T-20I/ML 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 44LD 20MIPS 24 KB RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
DSPIC30F3013T-20I/SO 功能描述:IC DSPIC MCU/DSP 24K 28SOIC RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:dsPIC™ 30F 產(chǎn)品培訓模塊:XLP Deep Sleep Mode 8-bit PIC® Microcontroller Portfolio 標準包裝:22 系列:PIC® XLP™ 18F 核心處理器:PIC 芯體尺寸:8-位 速度:48MHz 連通性:I²C，SPI，UART/USART，USB 外圍設備:欠壓檢測/復位，POR，PWM，WDT 輸入/輸出數(shù):14 程序存儲器容量:8KB（4K x 16） 程序存儲器類型:閃存 EEPROM 大小:256 x 8 RAM 容量:512 x 8 電壓 - 電源 (Vcc/Vdd):1.8 V ~ 5.5 V 數(shù)據(jù)轉換器:A/D 11x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:20-DIP（0.300"，7.62mm） 包裝:管件 產(chǎn)品目錄頁面:642 (CN2011-ZH PDF) 配用:DV164126-ND - KIT DEVELOPMENT USB W/PICKIT 2DM164127-ND - KIT DEVELOPMENT USB 18F14/13K50AC164112-ND - VOLTAGE LIMITER MPLAB ICD2 VPP
dsPIC30F3013T-30I/ML 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 44LD 30MIPS 24 KB RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
發(fā)布緊急采購，3分鐘左右您將得到回復。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*