參數(shù)資料
型號： DSPIC30F4013-20I/P
廠商： Microchip Technology
文件頁數(shù)： 89/153頁
文件大小： 0K
描述： IC DSPIC MCU/DSP 48K 40DIP
產(chǎn)品培訓(xùn)模塊： Serial Communications using dsPIC30F CAN
Serial Communications using dsPIC30F I2C
Serial Communications using dsPIC30F SPI
Serial Communications using dsPIC30F UART
dsPIC30F 12 bit ADC - Part 2
dsPIC30F Addressing Modes - Part 1
dsPIC30F Architecture - Part 1
dsPIC30F DSP Engine & ALU
dsPIC30F Interrupts
dsPIC30F Motor Control PWM
dsPIC Timers
Asynchronous Stimulus
dsPIC30F Addressing Modes - Part 2
dsPIC30F Architecture - Part 2
dsPIC30F 12-bit ADC Part 1
標(biāo)準(zhǔn)包裝： 10
系列： dsPIC™ 30F
核心處理器： dsPIC
芯體尺寸： 16-位
速度： 20 MIPS
連通性： CAN，I²C，SPI，UART/USART
外圍設(shè)備： AC'97，欠壓檢測/復(fù)位，I²S，POR，PWM，WDT
輸入/輸出數(shù)： 30
程序存儲器容量： 48KB（16K x 24）
程序存儲器類型： 閃存
EEPROM 大?。?/td> 1K x 8
RAM 容量： 2K x 8
電壓 - 電源 (Vcc/Vdd)： 2.5 V ~ 5.5 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 13x12b
振蕩器型： 內(nèi)部
工作溫度： -40°C ~ 85°C
封裝/外殼： 40-DIP（0.600"，15.24mm）
包裝： 管件
配用： AC30F003-ND - MODULE SOCKET DSPIC30F 40DIP
ACICE0206-ND - ADAPTER MPLABICE 40P 600 MIL
其它名稱： DSPIC30F4013-20IP
dsPIC30F3014/4013
DS70138G-page 40
2010 Microchip Technology Inc.
4.2.3
MODULO ADDRESSING
APPLICABILITY
Modulo Addressing can be applied to the Effective
Address (EA) calculation associated with any W
register. It is important to realize that the address
boundaries check for addresses less than or greater
than the upper (for incrementing buffers) and lower (for
decrementing buffers) boundary addresses (not just
equal to). Address changes may, therefore, jump
beyond boundaries and still be adjusted correctly.
4.3
Bit-Reversed Addressing
Bit-Reversed Addressing is intended to simplify data
re-ordering for radix-2 FFT algorithms. It is supported
by the X AGU for data writes only.
The modifier, which may be a constant value or register
contents, is regarded as having its bit order reversed. The
address source and destination are kept in normal order.
Thus, the only operand requiring reversal is the modifier.
4.3.1
BIT-REVERSED ADDRESSING
IMPLEMENTATION
Bit-Reversed Addressing is enabled when:
1.
BWM (W register selection) in the MODCON
register is any value other than ‘15’ (the stack
cannot
be
accessed
using
Bit-Reversed
Addressing) and
2.
the BREN bit is set in the XBREV register and
3.
the addressing mode used is Register Indirect
with Pre-Increment or Post-Increment.
If the length of a bit-reversed buffer is M = 2N bytes,
then the last ‘N’ bits of the data buffer start address
must be zeros.
XB<14:0> is the bit-reversed address modifier or ‘pivot
point’ which is typically a constant. In the case of an
FFT computation, its value is equal to half of the FFT
data buffer size.
When enabled, Bit-Reversed Addressing is only
executed for Register Indirect with Pre-Increment or
Post-Increment
Addressing
and
word-sized
data
writes. It does not function for any other addressing
mode or for byte sized data. Normal addresses are
generated instead. When Bit-Reversed Addressing is
active, the W Address Pointer is always added to the
address modifier (XB) and the offset associated with
the Register Indirect Addressing mode is ignored. In
addition, as word-sized data is a requirement, the LSb
of the EA is ignored (and always clear).
If Bit-Reversed Addressing has already been enabled
by setting the BREN (XBREV<15>) bit, then a write to
the XBREV register should not be immediately followed
by an indirect read operation using the W register that
has been designated as the Bit-Reversed Pointer.
FIGURE 4-2:
BIT-REVERSED ADDRESS EXAMPLE
Note:
The modulo corrected effective address is
written back to the register only when Pre-
Modify or Post-Modify Addressing mode is
used to compute the effective address.
When an address offset (e.g., [W7+W2])
is used, Modulo Addressing correction is
performed but the contents of the register
remain unchanged.
Note:
All bit-reversed EA calculations assume
word-sized data (LSb of every EA is
always clear). The XB value is scaled
accordingly to generate compatible (byte)
addresses.
Note:
Modulo
Addressing
and
Bit-Reversed
Addressing
should
not
be
enabled
together. In the event that the user
attempts to do this, Bit-Reversed Address-
ing assumes priority when active for the X
WAGU, and X WAGU Modulo Addressing
is disabled. However, Modulo Addressing
continues to function in the X RAGU.
b3 b2 b1
0
b2 b3 b4
0
Bit Locations Swapped Left-to-Right
Around Center of Binary Value
Bit-Reversed Address
XB = 0x0008 for a 16-word Bit-Reversed Buffer
b7 b6 b5 b1
b7 b6 b5 b4
b11 b10 b9 b8
b15 b14 b13 b12
Sequential Address
Pivot Point
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DSPIC30F4013-30I/ML 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC General Purpose RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
DSPIC30F4013-30I/P 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC General Purpose RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
DSPIC30F4013-30I/P 制造商:Microchip Technology Inc 功能描述:16BIT MCU-DSP 30MHZ 30F4013 DIP40
DSPIC30F4013-30I/PT 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC General Purpose RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
DSPIC30F4013-30I/PT 制造商:Microchip Technology Inc 功能描述:DIGITAL SIGNAL CONTROLLER 16 BIT ((NW))
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