P11/14
ECN30102 Product Specification
ECN30102
7. Quality Assurance
7.1 Appearance and dimension
ANSI Z1.4-1993
General inspection levels
ΙΙ AQL 1.0%
7.2 Electrical characteristics
ANSI Z1.4-1993
General inspection levels
ΙΙ AQL 0.65%
8. Does and Don’ts
8.1 Tightening torque at 0.39 to 0.78 Nm should be applied for device to attach to heat sink.
8.2 Tab should not be soldered.
8.3 How to protect semiconductor from electrical static discharge (ESD).
a) Material of container or any device to carry semiconductor devices should be free from ESD
which may be caused by vibration while transportation. To use electric-conductive container
or aluminum sheet is recommended as an effective countermeasure.
b) Those what touch semiconductor devices such as work platform, machine and measuring and
test equipment should be grounded.
c) Workers should be grounded connecting with high impedance around 100k
to 1M while
dealing with semiconductor to avoid electric static discharge which destroying IC.
d) Friction with other materials such as a high polymer should not be caused.
e) Attention is needed so that electric potential will be kept on the same level by short circuit
terminals when IC is mounted and carried on PC board in addition to that vibration or
friction might not occur.
f)
Air humidity must be controlled not to be so dry (less than 45% or so).
8.4 Applying molding or resin coating is recommended for below mentioned pin-to-pin insulation;
1-2, 2-4, 6-7, 8-9, 9-10, 20-21, 21-22, 22-23
8.5 Protective function against short circuit (ex. load short, line-to-ground short or top/bottom arm
short) is not built in this IC. External protection needs to prevent IC breakdown.
8.6 Hitachi high voltage IC is not under screening or process where extremely high reliability
is assured. In cases where extremely high reliability is required (such as nuclear power control,
aerospace and aviation, traffic equipment, life-support-related medical equipment, fuel control
equipment and various kinds of safety equipment) safety should be ensured by customers’ own
responsibility. See to it that IC’s breakdown should not damage one’s property or human life.
Users should follow the following ;
a)Enough deratings degree should be taken in order to minimize failure ratio against
maximum ratings considering temperature and operating stress.
b)Redundancy design should be applied depending on IC’s importance in a system so that
application’s performance will achieve even in a case of IC’s breakdown.
c)Reliability design should be implemented on the system, that is fail-safe design to protect property
and human life, and foolproof design for users are not very familiar with the system operation.
Refer to “Precautions for Use of High-Voltage Monolithic ICs”
for more details.
PDE-30102-2
Relation No.:IC-SP-01017 R2