參數(shù)資料
型號: EDE2108ABSE-6E-E
廠商: ELPIDA MEMORY INC
元件分類: DRAM
英文描述: 2G bits DDR2 SDRAM
中文描述: 256M X 8 DDR DRAM, 0.45 ns, PBGA68
封裝: ROHS COMPLIANT, FBGA-68
文件頁數(shù): 15/81頁
文件大?。?/td> 604K
代理商: EDE2108ABSE-6E-E
EDE2104ABSE, EDE2108ABSE
Preliminary Data Sheet E1196E10 (Ver. 1.0)
15
-8G
-6E
Speed bin
DDR2-800 (6-6-6)
DDR2-667 (5-5-5)
Parameter
Symbol
min.
max.
min.
max.
Unit
Notes
Write preamble
tWPRE
0.35
0.35
tCK
(avg)
ps
Address and control input hold time
tIH (base)
250
275
5
Address and control input setup time tIS (base)
175
200
ps
tCK
(avg)
tCK
(avg)
ns
4
Read preamble
tRPRE
0.9
1.1
0.9
1.1
11
Read postamble
tRPST
0.4
0.6
0.4
0.6
12
Active to precharge command
tRAS
45
70000
45
70000
Active to auto precharge delay
tRAP
tRCD min.
tRCD min.
ns
Active bank A to active bank B
command period
tRRD
7.5
7.5
ns
Four active window period
tFAW
35
37.5
ns
/CAS to /CAS command delay
tCCD
2
2
nCK
Write recovery time
Auto precharge write recovery +
precharge time
Internal write to read command delay tWTR
Internal read to precharge command
delay
Exit self-refresh to a non-read
command
Exit self-refresh to a read command
Exit precharge power-down to any
non-read command
Exit active power-down to read
command
Exit active power-down to read
command
(slow exit/low power mode)
CKE minimum pulse width (high and
low pulse width)
Output impedance test driver delay
tWR
15
WR
+
RU(tRP/tCK(avg))
7.5
15
WR
+
RU(tRP/tCK(avg))
7.5
ns
tDAL
nCK
1, 9
ns
tRTP
7.5
7.5
ns
tXSNR
tRFC
+
10
tRFC + 10
ns
tXSRD
200
200
nCK
tXP
2
2
nCK
tXARD
2
2
nCK
3
tXARDS
8
AL
7
AL
nCK
2, 3
tCKE
3
3
nCK
tOIT
0
12
0
12
ns
MRS command to ODT update delay
t
MOD
Auto-refresh to active/auto-refresh
command time
Average periodic refresh interval
(0
°
C
TC
+85
°
C)
(+85
°
C
<
TC
+95
°
C)
Minimum time clocks remains ON
after CKE asynchronously drops low
0
12
0
12
ns
tRFC
195
195
ns
tREFI
7.8
7.8
μ
s
tREFI
tIS
+
tCK(avg)
+
tIH
3.9
tIS
+
tCK(avg)
+
tIH
3.9
μ
s
tDELAY
ns
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