參數(shù)資料
型號(hào)： EFM32G230F128
廠商： Energy Micro
文件頁數(shù)： 60/67頁
文件大?。?/td> 0K
描述： IC MCU 32BIT 128KB FLASH 64QFN
特色產(chǎn)品： EFM32 Gecko
標(biāo)準(zhǔn)包裝： 1
系列： Gecko
核心處理器： ARM? Cortex?-M3
芯體尺寸： 32-位
速度： 32MHz
連通性： EBI/EMI，I²C，IrDA，智能卡，SPI，UART/USART
外圍設(shè)備： 欠壓檢測/復(fù)位，DMA，POR，PWM，WDT
輸入/輸出數(shù)： 56
程序存儲(chǔ)器容量： 128KB（128K x 8）
程序存儲(chǔ)器類型： 閃存
RAM 容量： 16K x 8
電壓 - 電源 (Vcc/Vdd)： 1.8 V ~ 3.8 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 8x12b，D/A 2x12b
振蕩器型： 外部
工作溫度： -40°C ~ 85°C
封裝/外殼： 64-VFQFN 裸露焊盤
包裝： 標(biāo)準(zhǔn)包裝
其它名稱： 914-1012-6
...the world's most energy friendly microcontrollers
2013-06-28 - EFM32G230FXX - d0005_Rev1.60
63
www.energymicro.com
Table of Contents
1. Ordering Information .................................................................................................................................. 2
2. System Summary ...................................................................................................................................... 3
2.1. System Introduction ......................................................................................................................... 3
2.2. Configuration Summary .................................................................................................................... 6
2.3. Memory Map ................................................................................................................................. 7
3. Electrical Characteristics ............................................................................................................................. 9
3.1. Test Conditions .............................................................................................................................. 9
3.2. Absolute Maximum Ratings .............................................................................................................. 9
3.3. General Operating Conditions ........................................................................................................... 9
3.4. Current Consumption ..................................................................................................................... 11
3.5. Transition between Energy Modes .................................................................................................... 18
3.6. Power Management ....................................................................................................................... 18
3.7. Flash .......................................................................................................................................... 19
3.8. General Purpose Input Output ......................................................................................................... 20
3.9. Oscillators .................................................................................................................................... 27
3.10. Analog Digital Converter (ADC) ...................................................................................................... 32
3.11. Digital Analog Converter (DAC) ...................................................................................................... 41
3.12. Analog Comparator (ACMP) .......................................................................................................... 43
3.13. Voltage Comparator (VCMP) ......................................................................................................... 45
3.14. Digital Peripherals ....................................................................................................................... 45
4. Pinout and Package ................................................................................................................................. 47
4.1. Pinout ......................................................................................................................................... 47
4.2. Alternate functionality pinout ............................................................................................................ 49
4.3. GPIO pinout overview .................................................................................................................... 52
4.4. QFN64 Package ........................................................................................................................... 53
5. PCB Layout and Soldering ........................................................................................................................ 54
5.1. Recommended PCB Layout ............................................................................................................ 54
5.2. Soldering Information ..................................................................................................................... 56
6. Chip Marking, Revision and Errata .............................................................................................................. 57
6.1. Chip Marking ................................................................................................................................ 57
6.2. Revision ...................................................................................................................................... 57
6.3. Errata ......................................................................................................................................... 57
7. Revision History ...................................................................................................................................... 58
7.1. Revision 1.60 ............................................................................................................................... 58
7.2. Revision 1.50 ............................................................................................................................... 58
7.3. Revision 1.40 ............................................................................................................................... 58
7.4. Revision 1.30 ............................................................................................................................... 58
7.5. Revision 1.20 ............................................................................................................................... 58
7.6. Revision 1.11 ............................................................................................................................... 59
7.7. Revision 1.10 ............................................................................................................................... 59
7.8. Revision 1.00 ............................................................................................................................... 59
7.9. Revision 0.85 ............................................................................................................................... 59
7.10. Revision 0.84 .............................................................................................................................. 60
7.11. Revision 0.83 .............................................................................................................................. 60
7.12. Revision 0.82 .............................................................................................................................. 60
7.13. Revision 0.81 .............................................................................................................................. 60
7.14. Revision 0.80 .............................................................................................................................. 60
A. Disclaimer and Trademarks ....................................................................................................................... 61
A.1. Disclaimer ................................................................................................................................... 61
A.2. Trademark Information ................................................................................................................... 61
B. Contact Information ................................................................................................................................. 62
B.1. Energy Micro Corporate Headquarters .............................................................................................. 62
B.2. Global Contacts ............................................................................................................................ 62
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