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參數(shù)資料
| 型號： | EFM32G230F128 |
| 廠商： | Energy Micro |
| 文件頁數(shù)： | 61/67頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MCU 32BIT 128KB FLASH 64QFN |
| 特色產(chǎn)品： | EFM32 Gecko |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | Gecko |
| 核心處理器： | ARM? Cortex?-M3 |
| 芯體尺寸： | 32-位 |
| 速度： | 32MHz |
| 連通性： | EBI/EMI，I²C，IrDA，智能卡，SPI，UART/USART |
| 外圍設(shè)備： | 欠壓檢測/復(fù)位，DMA，POR，PWM，WDT |
| 輸入/輸出數(shù)： | 56 |
| 程序存儲器容量： | 128KB（128K x 8） |
| 程序存儲器類型： | 閃存 |
| RAM 容量： | 16K x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 1.8 V ~ 3.8 V |
| 數(shù)據(jù)轉(zhuǎn)換器： | A/D 8x12b，D/A 2x12b |
| 振蕩器型： | 外部 |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 64-VFQFN 裸露焊盤 |
| 包裝： | 標(biāo)準(zhǔn)包裝 |
| 其它名稱： | 914-1012-6 |
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...the world's most energy friendly microcontrollers
2013-06-28 - EFM32G230FXX - d0005_Rev1.60
64
www.energymicro.com
List of Figures
2.1. Block Diagram ....................................................................................................................................... 3
2.2. EFM32G230 Memory Map with largest RAM and Flash sizes .......................................................................... 8
28MHz ..................................................................................................................................................... 12
21MHz ..................................................................................................................................................... 12
14MHz ..................................................................................................................................................... 13
11MHz ..................................................................................................................................................... 13
7MHz ....................................................................................................................................................... 14
3.6. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 28MHz ............................... 14
3.7. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 21MHz ............................... 15
3.8. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 14MHz ............................... 15
3.9. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 11MHz ............................... 16
3.10. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 7MHz ............................... 16
3.11. EM2 current consumption. RTC prescaled to 1kHz, 32 kHz LFRCO. ............................................................. 17
3.12. EM3 current consumption. ................................................................................................................... 17
3.13. EM4 current consumption. ................................................................................................................... 18
3.14. Typical Low-Level Output Current, 2V Supply Voltage ................................................................................ 21
3.15. Typical High-Level Output Current, 2V Supply Voltage ................................................................................ 22
3.16. Typical Low-Level Output Current, 3V Supply Voltage ................................................................................ 23
3.17. Typical High-Level Output Current, 3V Supply Voltage ................................................................................ 24
3.18. Typical Low-Level Output Current, 3.8V Supply Voltage .............................................................................. 25
3.19. Typical High-Level Output Current, 3.8V Supply Voltage ............................................................................. 26
3.20. Calibrated LFRCO Frequency vs Temperature and Supply Voltage .............................................................. 29
3.21. Calibrated HFRCO 11 MHz Band Frequency vs Temperature and Supply Voltage ........................................... 31
3.22. Calibrated HFRCO 14 MHz Band Frequency vs Temperature and Supply Voltage ........................................... 31
3.23. Calibrated HFRCO 21 MHz Band Frequency vs Temperature and Supply Voltage ........................................... 31
3.24. Calibrated HFRCO 28 MHz Band Frequency vs Temperature and Supply Voltage ........................................... 32
3.25. Integral Non-Linearity (INL) ................................................................................................................... 36
3.26. Differential Non-Linearity (DNL) .............................................................................................................. 37
3.27. ADC Frequency Spectrum, Vdd = 3V, Temp = 25° ................................................................................... 38
3.28. ADC Integral Linearity Error vs Code, Vdd = 3V, Temp = 25° ..................................................................... 39
3.29. ADC Differential Linearity Error vs Code, Vdd = 3V, Temp = 25° ................................................................. 40
3.30. ADC Absolute Offset, Common Mode = Vdd /2 ........................................................................................ 41
3.31. ADC Dynamic Performance vs Temperature for all ADC References, Vdd = 3V .............................................. 41
3.32. Typical ACMP Characteristics ............................................................................................................... 44
4.1. EFM32G230 Pinout (top view, not to scale) ............................................................................................... 47
4.2. QFN64 ................................................................................................................................................ 53
5.1. QFN64 PCB Land Pattern ...................................................................................................................... 54
5.2. QFN64 PCB Solder Mask ....................................................................................................................... 55
5.3. QFN64 PCB Stencil Design .................................................................................................................... 56
6.1. Example Chip Marking ........................................................................................................................... 57
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