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參數(shù)資料
| 型號(hào)： | EH1345TTS-66.6667M-G |
| 廠商： | ECLIPTEK CORP |
| 元件分類： | XO, clock |
| 英文描述： | CRYSTAL OSCILLATOR, CLOCK, 66.6667 MHz, LVCMOS OUTPUT |
| 封裝： | ROHS COMPLIANT, METAL, GULLWING, DIP-14/4 |
| 文件頁(yè)數(shù)： | 6/6頁(yè) |
| 文件大小： | 164K |
| 代理商： | EH1345TTS-66.6667M-G |
T Min
S
T Max
S
Critical Zone
T to T
L
P
Ramp-up
Ramp-down
T
L
T
P
t 25°C to Peak
t Preheat
S
t L
t
P
Temperature
(T)
Time (t)
Recommended Solder Reflow Methods
EH1345TTS-66.6667M-G
Low Temperature Solder Bath (Wave Solder)
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
N/A
- Temperature Typical (TS TYP)
150°C
- Temperature Maximum (TS MAX)
N/A
- Time (tS MIN)
30 - 60 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
150°C
- Time (tL)
200 Seconds Maximum
Peak Temperature (TP)
245°C Maximum
Target Peak Temperature (TP Target)
245°C Maximum 1 Time / 235°C Maximum 2 Times
Time within 5°C of actual peak (tp)
5 seconds Maximum 1 Time / 15 seconds Maximum 2 Times
Ramp-down Rate
5°C/second Maximum
Time 25°C to Peak Temperature (t)
N/A
Moisture Sensitivity Level
Level 1
Additional Notes
Temperatures shown are applied to back of PCB board and device leads
only. Do not use this method for product with the Gull Wing option.
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum. (Temperatures listed are applied to device leads only.
This method can be utilized with both Gull Wing and Non-Gull Wing devices.)
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum. (Temperatures listed are applied to device leads only. This
method can be utilized with both Gull Wing and Non-Gull Wing devices.)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 3/12/2011 | Page 6 of 6
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