參數(shù)資料
型號(hào): EM773FHN33,551
廠商: NXP Semiconductors
文件頁(yè)數(shù): 39/51頁(yè)
文件大小: 0K
描述: IC ENERGY METER ARM 32VQFN
其它有關(guān)文件: EM773 Energy Metering IC Training
特色產(chǎn)品: EM773 Energy Metering IC
標(biāo)準(zhǔn)包裝: 260
核心處理器: ARM? Cortex?-M0
芯體尺寸: 32-位
速度: 48MHz
連通性: I²C,SPI,UART/USART
外圍設(shè)備: 欠壓檢測(cè)/復(fù)位,POR,WDT
輸入/輸出數(shù): 25
程序存儲(chǔ)器容量: 32KB(32K x 8)
程序存儲(chǔ)器類型: 閃存
RAM 容量: 8K x 8
電壓 - 電源 (Vcc/Vdd): 1.8 V ~ 3.6 V
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 32-VQFN 裸露焊盤
包裝: 托盤
配用: 568-6681-ND - BOARD EVAL EM773 METER EU PLUG
568-6680-ND - BOARD EVAL EM773 METER US PLUG
其它名稱: 568-5213
EM773
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 2 — 3 January 2012
44 of 51
NXP Semiconductors
EM773
Energy metering IC
12. Package outline
Fig 26. Package outline (HVQFN33 5x5)
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
MO-220
hvqfn33f_po
11-10-11
11-10-17
Unit(1)
mm
max
nom
min
0.85
0.05
0.00
0.2
5.1
4.9
3.75
3.45
5.1
4.9
3.75
3.45
0.5
3.5
A1
Dimensions (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
HVQFN33: plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5 x 5 x 0.85 mm
bc
0.30
0.18
D(1)
A(1)
Dh
E(1)
Eh
ee1
e2
L
3.5
vw
0.1
y
0.05
0.5
0.3
y1
0.05
0
2.5
5 mm
scale
1/2 e
A
C
B
v
C
w
terminal 1
index area
A
A1
c
detail X
y
y1 C
e
L
Eh
Dh
e
e1
b
916
32
25
24
17
8
1
X
D
E
C
B
A
e2
terminal 1
index area
1/2 e
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