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參數(shù)資料
型號: EP1K30FC256-2
廠商: Altera
文件頁數(shù): 51/86頁
文件大?。?/td> 0K
描述: IC ACEX 1K FPGA 30K 256-FBGA
產(chǎn)品培訓模塊: Three Reasons to Use FPGA's in Industrial Designs
標準包裝: 90
系列: ACEX-1K®
LAB/CLB數(shù): 216
邏輯元件/單元數(shù): 1728
RAM 位總計: 24576
輸入/輸出數(shù): 171
門數(shù): 119000
電源電壓: 2.375 V ~ 2.625 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 256-BGA
供應商設備封裝: 256-FBGA(17x17)
產(chǎn)品目錄頁面: 602 (CN2011-ZH PDF)
其它名稱: 544-1831
EP1K30FC256-2-ND
Altera Corporation
55
ACEX 1K Programmable Logic Device Family Data Sheet
D
e
ve
lo
pm
e
n
t
13
To
o
ls
tCASC
Cascade-in to cascade-out delay
tC
LE register control signal delay
tCO
LE register clock-to-output delay
tCOMB
Combinatorial delay
tSU
LE register setup time for data and enable signals before clock; LE register
recovery time after asynchronous clear, preset, or load
tH
LE register hold time for data and enable signals after clock
tPRE
LE register preset delay
tCLR
LE register clear delay
tCH
Minimum clock high time from clock pin
tCL
Minimum clock low time from clock pin
Table 23. IOE Timing Microparameters
Symbol
Parameter
Conditions
tIOD
IOE data delay
tIOC
IOE register control signal delay
tIOCO
IOE register clock-to-output delay
tIOCOMB
IOE combinatorial delay
tIOSU
IOE register setup time for data and enable signals before clock; IOE register
recovery time after asynchronous clear
tIOH
IOE register hold time for data and enable signals after clock
tIOCLR
IOE register clear time
tOD1
Output buffer and pad delay, slow slew rate = off, VCCIO = 3.3 V
C1 = 35 pF (2)
tOD2
Output buffer and pad delay, slow slew rate = off, VCCIO = 2.5 V
C1 = 35 pF (3)
tOD3
Output buffer and pad delay, slow slew rate = on
C1 = 35 pF (4)
tXZ
IOE output buffer disable delay
tZX1
IOE output buffer enable delay, slow slew rate = off, VCCIO = 3.3 V
C1 = 35 pF (2)
tZX2
IOE output buffer enable delay, slow slew rate = off, VCCIO = 2.5 V
C1 = 35 pF (3)
tZX3
IOE output buffer enable delay, slow slew rate = on
C1 = 35 pF (4)
tINREG
IOE input pad and buffer to IOE register delay
tIOFD
IOE register feedback delay
tINCOMB
IOE input pad and buffer to FastTrack Interconnect delay
Table 22. LE Timing Microparameters (Part 2 of 2)
Note (1)
Symbol
Parameter
Conditions
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EP1K30FC256-2N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - ACEX 1K 216 LABs 171 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EP1K30FC256-3 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - ACEX 1K 216 LABs 171 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EP1K30FC256-3N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - ACEX 1K 216 LABs 171 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EP1K30FI256-2 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - ACEX 1K 216 LABs 171 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EP1K30FI256-2N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - ACEX 1K 216 LABs 171 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256