Altera Corporation
4–65
February 2005
Stratix GX Device Handbook, Volume 3
Stratix GX Board Design Guidelines
engineering team’s knowledge of the system, the fabrication house, and
the simulations.
Table 4–6 shows the stackup for the Stratix GX
development board.
Because of the large number of power and ground planes needed on the
Stratix GX development board, Altera uses a symmetrical stackup that is
optimized for striplines. The dielectric thickness, permittivity, and trace
width were chosen so that the total board thickness was approximately
0.093 in. A minimum trace width of 0.004 in keeps costs low and reduces
the effects of fabrication deviations. The layer count is set based on the
density of the board.
The development board material is NELCO FR-4 4000-6, which is an
enhanced multifunctional, high temperature resin system that shows a
relative permittivity of ~3.86. and tan
δ of 0.022. The stackup consists of 6
solid planes and 12 signal layers arranged symmetrically from the center.
Table 4–6. Stratix GX Stack-Up
Layer Number
Type
Cu Weight
(oz)
Foil
Thickness
(in.)
Dielectric
Thickness
(in.)
Construction
εr
1
Signal
0.5
0.0007
0.0036
1
× 1080
3.76
2
Plane
1.0
0.0014
0.0040
1080 + 2113
4.00
3
Signal
0.5
0.0007
0.0061
2116
3.86
4
Signal
0.5
0.0007
0.0040
1080 + 2113
4.00
5
Plane
1.0
0.0014
0.0045
1080 + 2113
3.86
6
Signal
0.5
0.0007
0.005
2116
3.63
7
Signal
0.5
0.0007
0.0045
1080 + 2113
3.86
8
Plane
1.0
0.0014
0.0040
1080 + 2113
4.00
9
Signal
0.5
0.0007
0.0061
2116
3.86
10
Signal
0.5
0.0007
0.0045
1080 + 2113
4.00
11
Plane
1.0
0.0014
0.005
1080 + 2113
4.00
12
Signal
0.5
0.0007
0.0045
2116
3.86
13
Signal
0.5
0.0007
0.005
1080 + 2113
4.00
14
Plane
1.0
0.0014
0.0045
1080 + 2113
4.00
15
Signal
0.5
0.0007
0.0061
2116
3.86
16
Signal
0.5
0.0007
0.0040
1080 + 2113
4.00
17
Plane
1.0
0.0014
0.0036
1
× 1080
3.76
18
Signal
0.5
0.0007
Total Thickness Cu to Cu (in.)
0.093 ± 0.006