Notes to Figure 29: (1) For more i" />
參數(shù)資料
型號(hào): EP20K100EBI356-2X
廠商: Altera
文件頁(yè)數(shù): 58/117頁(yè)
文件大小: 0K
描述: IC APEX 20KE FPGA 100K 356-BGA
標(biāo)準(zhǔn)包裝: 24
系列: APEX-20K®
LAB/CLB數(shù): 416
邏輯元件/單元數(shù): 4160
RAM 位總計(jì): 53248
輸入/輸出數(shù): 246
門數(shù): 263000
電源電壓: 1.71 V ~ 1.89 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 356-BGA
供應(yīng)商設(shè)備封裝: 356-BGA(35x35)
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)當(dāng)前第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)
Altera Corporation
45
APEX 20K Programmable Logic Device Family Data Sheet
Figure 29. APEX 20KE I/O Banks
Notes to Figure 29:
(1)
For more information on placing I/O pins in LVDS blocks, refer to the Guidelines for
Using LVDS Blocks section in Application Note 120 (Using LVDS in APEX 20KE
Devices).
(2)
If the LVDS input and output blocks are not used for LVDS, they can support all of
the I/O standards and can be used as input, output, or bidirectional pins with
VCCIO set to 3.3 V, 2.5 V, or 1.8 V.
Power Sequencing & Hot Socketing
Because APEX 20K and APEX 20KE devices can be used in a mixed-
voltage environment, they have been designed specifically to tolerate any
possible power-up sequence. Therefore, the VCCIO and VCCINT power
supplies may be powered in any order.
f For more information, please refer to the “Power Sequencing
Considerations” section in the Configuring APEX 20KE & APEX 20KC
Devices chapter of the Configuration Devices Handbook.
Signals can be driven into APEX 20K devices before and during power-up
without damaging the device. In addition, APEX 20K devices do not drive
out during power-up. Once operating conditions are reached and the
device is configured, APEX 20K and APEX 20KE devices operate as
specified by the user.
LVDS/LVPECL
Input
Block (2)
(1)
LVDS/LVPECL
Output
Block (2)
(1)
Regular I/O Blocks Support
LVTTL
LVCMOS
2.5 V
1.8 V
3.3 V PCI
LVPECL
HSTL Class I
GTL+
SSTL-2 Class I and II
SSTL-3 Class I and II
CTT
AGP
Individual
Power Bus
I/O Bank 8
I/O Bank 1
I/O Bank 2
I/O Bank 3
I/O Bank 4
I/O Bank 5
I/O Bank 6
I/O Bank 7
相關(guān)PDF資料
PDF描述
ABB65DHAN CONN EDGECARD 130PS R/A .050 SLD
ABB65DHAD CONN EDGECARD 130PS R/A .050 SLD
ASM31DTAS CONN EDGECARD 62POS R/A .156 SLD
FMC19DREF-S734 CONN EDGECARD 38POS .100 EYELET
ACC60DRYN-S13 CONN EDGECARD 120POS .100 EXTEND
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EP20K100EBI356-3ES 制造商:未知廠家 制造商全稱:未知廠家 功能描述:FPGA
EP20K100EFC144-1 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 CPLD - APEX 20K 416 Macro 93 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP20K100EFC144-1ES 制造商:未知廠家 制造商全稱:未知廠家 功能描述:FPGA
EP20K100EFC144-1X 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 CPLD - APEX 20K 416 Macro 93 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP20K100EFC144-2 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 CPLD - APEX 20K 416 Macro 93 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256