參數(shù)資料
型號： EP4SGX70HF35C3
廠商： Altera
文件頁數(shù)： 73/82頁
文件大小： 0K
描述： IC STRATIX IV FPGA 70K 1152FBGA
產(chǎn)品培訓(xùn)模塊： Three Reasons to Use FPGA's in Industrial Designs
標(biāo)準(zhǔn)包裝： 3
系列： Stratix® IV GX
LAB/CLB數(shù)： 2904
邏輯元件/單元數(shù)： 72600
RAM 位總計： 7564880
輸入/輸出數(shù)： 488
電源電壓： 0.87 V ~ 0.93 V
安裝類型： 表面貼裝
工作溫度： 0°C ~ 85°C
封裝/外殼： 1152-BBGA
供應(yīng)商設(shè)備封裝： 1152-FBGA（27x27）
Chapter 1: DC and Switching Characteristics for Stratix IV Devices
1–67
Glossary
March 2014
Altera Corporation
Stratix IV Device Handbook
Volume 4: Device Datasheet and Addendum
Document Revision History
Table 1–55 lists the revision history for this chapter.
V
VCM(DC)
DC Common mode input voltage.
VICM
Input Common mode voltage—The common mode of the differential signal at the receiver.
VID
Input differential voltage swing—The difference in voltage between the positive and
complementary conductors of a differential transmission at the receiver.
VDIF(AC)
AC differential input voltage—Minimum AC input differential voltage required for switching.
VDIF(DC)
DC differential input voltage— Minimum DC input differential voltage required for switching.
VIH
Voltage input high—The minimum positive voltage applied to the input which is accepted by
the device as a logic high.
VIH(AC)
High-level AC input voltage
VIH(DC)
High-level DC input voltage
VIL
Voltage input low—The maximum positive voltage applied to the input which is accepted by
the device as a logic low.
VIL(AC)
Low-level AC input voltage
VIL(DC)
Low-level DC input voltage
VOCM
Output Common mode voltage—The common mode of the differential signal at the
transmitter.
VOD
Output differential voltage swing—The difference in voltage between the positive and
complementary conductors of a differential transmission at the transmitter.
VSWING
Differential input voltage
VX
Input differential cross point voltage
VOX
Output differential cross point voltage
W
W
High-speed I/O block: Clock Boost Factor
X, Y, Z
——
Table 1–54. Glossary Table (Part 4 of 4)
Letter
Subject
Definitions
Table 1–55. Document Revision History (Part 1 of 3)
Date
Version
Changes
March 2014
5.8
■ Added note to Table 1–49.
■ Updated D6 row in Table 1–52.
January 2014
5.7
■ Updated Table 1–42.
December 2013
5.6
■ Updated Table 1–23 and Table 1–24.
November 2013
5.5
■ Updated Table 1–23 and Table 1–24.
November 2013
5.4
■ Updated Table 1–42, Table 1–23, and Table 1–24.
July 2012
5.3
■ Added Table 1–5 and Table 1–40.
■ Updated Table 1–15, Table 1–22, Table 1–23, Table 1–30, Table 1–33, Table 1–35,
Table 1–36, Table 1–39, Table 1–42 and Table 1–51.
■ Removed “Schmitt Trigger Input” section.
December 2011
5.2
■ Added Figure 1–7.
■ Updated Table 1–22 and Table 1–41.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EP4SGX70HF35C3N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Stratix IV GX 2904 LABs 488 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP4SGX70HF35C4 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Stratix IV GX 2904 LABs 488 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP4SGX70HF35C4N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Stratix IV GX 2904 LABs 488 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP4SGX70HF35I3 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Stratix IV GX 2904 LABs 488 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP4SGX70HF35I3N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Stratix IV GX 2904 LABs 488 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
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