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    參數(shù)資料
    

    


    


    
型號(hào)：
EPF10K100EQC240-2N

    

    
廠商：
Altera

    

    
文件頁(yè)數(shù)：
98/100頁(yè)

    

    
文件大?。?/td>
0K

    

    
描述：
IC FLEX 10KE FPGA 100K 240-PQFP

    

    
產(chǎn)品培訓(xùn)模塊：
Three Reasons to Use FPGA's in Industrial Designs
    		

    

    
標(biāo)準(zhǔn)包裝：
24

    

    
系列：
FLEX-10KE®

    

    
LAB/CLB數(shù)：
624
    		

    

    
邏輯元件/單元數(shù)：
4992
    		

    

    
RAM 位總計(jì)：
49152
    		

    

    
輸入/輸出數(shù)：
189
    		

    

    
門數(shù)：
257000
    		

    

    
電源電壓：
2.375 V ~ 2.625 V
    		

    

    
安裝類型：
表面貼裝
    		

    

    
工作溫度：
0°C ~ 85°C
    		

    

    
封裝/外殼：
240-BFQFP
    		

    

    
供應(yīng)商設(shè)備封裝：
240-PQFP（32x32）
    		

    

    

    

	
    
    
    

    
    
	
    Altera Corporation
    97
    FLEX 10KE Embedded Programmable Logic Devices Data Sheet
    During initialization, which occurs immediately after configuration, the
    device resets registers, enables I/O pins, and begins to operate as a logic
    device. The I/O pins are tri-stated during power-up, and before and
    during configuration. Together, the configuration and initialization
    processes are called command mode; normal device operation is called user
    mode.
    SRAM configuration elements allow FLEX 10KE devices to be
    reconfigured in-circuit by loading new configuration data into the device.
    Real-time reconfiguration is performed by forcing the device into
    command mode with a device pin, loading different configuration data,
    reinitializing the device, and resuming user-mode operation. The entire
    reconfiguration process requires less than 85 ms and can be used to
    reconfigure an entire system dynamically. In-field upgrades can be
    performed by distributing new configuration files.
    Before and during configuration, all I/O pins (except dedicated inputs,
    clock, or configuration pins) are pulled high by a weak pull-up resistor.
    Programming Files
    Despite being function- and pin-compatible, FLEX 10KE devices are not
    programming- or configuration file-compatible with FLEX 10K or
    FLEX 10KA devices. A design therefore must be recompiled before it is
    transferred from a FLEX 10K or FLEX 10KA device to an equivalent
    FLEX 10KE device. This recompilation should be performed both to create
    a new programming or configuration file and to check design timing in
    FLEX 10KE devices, which has different timing characteristics than
    FLEX 10K or FLEX 10KA devices.
    FLEX 10KE devices are generally pin-compatible with equivalent
    FLEX 10KA devices. In some cases, FLEX 10KE devices have fewer I/O
    pins than the equivalent FLEX 10KA devices. Table 81 shows which
    FLEX 10KE devices have fewer I/O pins than equivalent FLEX 10KA
    devices. However, power, ground, JTAG, and configuration pins are the
    same on FLEX 10KA and FLEX 10KE devices, enabling migration from a
    FLEX 10KA design to a FLEX 10KE design.
    
    
    
    
    
    


    


    

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EPF10K100EQC240-2
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    相關(guān)代理商/技術(shù)參數(shù)
    		

    參數(shù)描述
    		

    
    

    
EPF10K100EQC240-2X
功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 624 LABs 189 IOs

 RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256

    

    
EPF10K100EQC2403
 制造商:Altera Corporation 功能描述:

    

    
EPF10K100EQC240-3
功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 624 LABs 189 IOs

 RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256

    

    
EPF10K100EQC240-3DX
 制造商:未知廠家 制造商全稱:未知廠家 功能描述:ASIC

    

    
EPF10K100EQC240-3N
功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 624 LABs 189 IOs

 RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256

    

    
    
    
    
	
    	
    
    
     
     
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