fMAX = Maximum ope" />
參數(shù)資料
型號: EPF10K10QC208-4
廠商: Altera
文件頁數(shù): 26/128頁
文件大小: 0K
描述: IC FLEX 10K FPGA 10K 208-PQFP
產(chǎn)品培訓(xùn)模塊: Three Reasons to Use FPGA's in Industrial Designs
標(biāo)準(zhǔn)包裝: 144
系列: FLEX-10K®
LAB/CLB數(shù): 72
邏輯元件/單元數(shù): 576
RAM 位總計(jì): 6144
輸入/輸出數(shù): 134
門數(shù): 31000
電源電壓: 4.75 V ~ 5.25 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 208-BFQFP
供應(yīng)商設(shè)備封裝: 208-PQFP(28x28)
產(chǎn)品目錄頁面: 603 (CN2011-ZH PDF)
其它名稱: 544-2196
Altera Corporation
121
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
fMAX
=
Maximum operating frequency in MHz
N
=
Total number of logic cells used in the device
togLC
=
Average percent of logic cells toggling at each clock
(typically 12.5%)
K
=
Constant, shown in Tables 114 and 115
This calculation provides an ICC estimate based on typical conditions with
no output load. The actual ICC should be verified during operation
because this measurement is sensitive to the actual pattern in the device
and the environmental operating conditions.
To better reflect actual designs, the power model (and the constant K in
the power calculation equations) for continuous interconnect FLEX
devices assumes that logic cells drive FastTrack Interconnect channels. In
contrast, the power model of segmented FPGAs assumes that all logic
cells drive only one short interconnect segment. This assumption may
lead to inaccurate results, compared to measured power consumption for
an actual design in a segmented interconnect FPGA.
Figure 32 shows the relationship between the current and operating
frequency of FLEX 10K devices.
Table 114. FLEX 10K K Constant Values
Device
K Value
EPF10K10
82
EPF10K20
89
EPF10K30
88
EPF10K40
92
EPF10K50
95
EPF10K70
85
EPF10K100
88
Table 115. FLEX 10KA K Constant Values
Device
K Value
EPF10K10A
17
EPF10K30A
17
EPF10K50V
19
EPF10K100A
19
EPF10K130V
22
EPF10K250A
23
相關(guān)PDF資料
PDF描述
VI-BNR-CY-F2 CONVERTER MOD DC/DC 7.5V 50W
VI-BNP-CY-F3 CONVERTER MOD DC/DC 13.8V 50W
EPF10K10AQC208-3N IC FLEX 10KA FPGA 10K 208-PQFP
TAP685K050CRW CAP TANT 6.8UF 50V 10% RADIAL
M24308/23-31 CONN D-SUB RCPT 9POS R/A PCB
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EPF10K10QC208-4N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 72 LABs 134 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K10QI208-4 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 72 LABs 134 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K10QI208-4N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 72 LABs 134 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K10TC144-3 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 72 LABs 102 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K10TC144-3N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 72 LABs 102 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256