Notes to tables: (1) Microparameters are timing delays contribut" />
參數(shù)資料
型號： EPF10K200SFC484-1X
廠商： Altera
文件頁數(shù)： 59/100頁
文件大小： 0K
描述： IC FLEX 10KS FPGA 200K 484-FBGA
產(chǎn)品培訓模塊： Three Reasons to Use FPGA's in Industrial Designs
標準包裝： 60
系列： FLEX-10KE®
LAB/CLB數(shù)： 1248
邏輯元件/單元數(shù)： 9984
RAM 位總計： 98304
輸入/輸出數(shù)： 369
門數(shù)： 513000
電源電壓： 2.375 V ~ 2.625 V
安裝類型： 表面貼裝
工作溫度： 0°C ~ 85°C
封裝/外殼： 484-BGA
供應商設備封裝： 484-FBGA（23x23）
其它名稱： EPF10K200SFC4841X
Altera Corporation
61
FLEX 10KE Embedded Programmable Logic Devices Data Sheet
Notes to tables:
(1)
Microparameters are timing delays contributed by individual architectural elements. These parameters cannot be
measured explicitly.
(2)
Operating conditions: VCCIO = 3.3 V ±10% for commercial or industrial use.
(3)
Operating conditions: VCCIO = 2.5 V ±5% for commercial or industrial use in EPF10K30E, EPF10K50S,
EPF10K100E, EPF10K130E, and EPF10K200S devices.
(4)
Operating conditions: VCCIO = 3.3 V.
(5)
Because the RAM in the EAB is self-timed, this parameter can be ignored when the WE signal is registered.
(6)
EAB macroparameters are internal parameters that can simplify predicting the behavior of an EAB at its boundary;
these parameters are calculated by summing selected microparameters.
(7)
These parameters are worst-case values for typical applications. Post-compilation timing simulation and timing
analysis are required to determine actual worst-case performance.
(8)
Contact Altera Applications for test circuit specifications and test conditions.
(9)
This timing parameter is sample-tested only.
(10) This parameter is measured with the measurement and test conditions, including load, specified in the PCI Local
Bus Specification, revision 2.2.
Table 30. External Bidirectional Timing Parameters
Symbol
Parameter
Conditions
tINSUBIDIR
Setup time for bi-directional pins with global clock at same-row or same-
column LE register
tINHBIDIR
Hold time for bidirectional pins with global clock at same-row or same-column
LE register
tINH
Hold time with global clock at IOE register
tOUTCOBIDIR
Clock-to-output delay for bidirectional pins with global clock at IOE register
C1 = 35 pF
tXZBIDIR
Synchronous IOE output buffer disable delay
C1 = 35 pF
tZXBIDIR
Synchronous IOE output buffer enable delay, slow slew rate= off
C1 = 35 pF
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相關代理商/技術參數(shù)
參數(shù)描述
EPF10K200SFC484-2 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 1248 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K200SFC484-2N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 1248 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K200SFC484-2X 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 1248 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K200SFC484-3 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 1248 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K200SFC484-3N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 1248 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
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