參數(shù)資料
型號： EPF10K30ABC356-1
廠商： Altera
文件頁數(shù)： 68/128頁
文件大小： 0K
描述： IC FLEX 10K FPGA 30K 356-BGA
產(chǎn)品培訓模塊： Three Reasons to Use FPGA's in Industrial Designs
標準包裝： 24
系列： FLEX-10K®
LAB/CLB數(shù)： 216
邏輯元件/單元數(shù)： 1728
RAM 位總計： 12288
輸入/輸出數(shù)： 246
門數(shù)： 69000
電源電壓： 3 V ~ 3.6 V
安裝類型： 表面貼裝
工作溫度： 0°C ~ 85°C
封裝/外殼： 356-BGA
供應商設備封裝： 356-BGA（35x35）
44
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Generic Testing
Each FLEX 10K device is functionally tested. Complete testing of each
configurable SRAM bit and all logic functionality ensures 100% yield.
AC test measurements for FLEX 10K devices are made under conditions
equivalent to those shown in Figure 19. Multiple test patterns can be used
to configure devices during all stages of the production flow.
Figure 19. FLEX 10K AC Test Conditions
Operating
Conditions
Tables 17 through 21 provide information on absolute maximum ratings,
recommended operating conditions, DC operating conditions, and
capacitance for 5.0-V FLEX 10K devices.
VCC
To Test
System
C1 (includes
JIG capacitance)
Device input
rise and fall
times < 3 ns
Device
Output
250
(8.06 k
)
[481
]
464
(703
)
[521
]
Power supply transients can affect AC
measurements. Simultaneous transitions of
multiple outputs should be avoided for
accurate measurement. Threshold tests must
not be performed under AC conditions.
Large-amplitude, fast-ground-current
transients normally occur as the device
outputs discharge the load capacitances.
When these transients flow through the
parasitic inductance between the device
ground pin and the test system ground,
significant reductions in observable noise
immunity can result. Numbers without
parentheses are for 5.0-V devices or outputs.
Numbers in parentheses are for 3.3-V devices
or outputs. Numbers in brackets are for
2.5-V devices or outputs.
Table 17. FLEX 10K 5.0-V Device Absolute Maximum Ratings
Symbol
Parameter
Conditions
Min
Max
Unit
VCC
Supply voltage
With respect to ground (2)
–2.0
7.0
V
VI
DC input voltage
–2.0
7.0
V
IOUT
DC output current, per pin
–25
25
mA
TSTG
Storage temperature
No bias
–65
150
° C
TAMB
Ambient temperature
Under bias
–65
135
° C
TJ
Junction temperature
Ceramic packages, under bias
150
° C
PQFP, TQFP, RQFP, and BGA
packages, under bias
135
° C
相關PDF資料
PDF描述
AMC31DREI-S93 CONN EDGECARD 62POS .100 EYELET
25LC080D-I/MS IC SRL EEPROM 1KX8 2.5V 8-MSOP
25AA080B-I/ST IC EEPROM 8KBIT 10MHZ 8TSSOP
5-212534-1 CONN D-SUB RCPT HSING 21C4 MIX
RBB105DHBS CONN EDGECARD 210PS R/A .050 DIP
相關代理商/技術參數(shù)
參數(shù)描述
EPF10K30ABC3562 制造商:ALTERA 功能描述:New
EPF10K30ABC356-2 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 216 LABs 246 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K30ABC356-3 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 216 LABs 246 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K30ABI356-3 制造商:Rochester Electronics LLC 功能描述: 制造商:Altera Corporation 功能描述:
EPF10K30AFC256-1 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 216 LABs 191 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
發(fā)布緊急采購，3分鐘左右您將得到回復。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*