參數(shù)資料
型號: EPF10K30AFC484-1
廠商: Altera
文件頁數(shù): 59/128頁
文件大小: 0K
描述: IC FLEX 10KA FPGA 30K 484-FBGA
產(chǎn)品培訓(xùn)模塊: Three Reasons to Use FPGA's in Industrial Designs
標(biāo)準(zhǔn)包裝: 60
系列: FLEX-10K®
LAB/CLB數(shù): 216
邏輯元件/單元數(shù): 1728
RAM 位總計(jì): 12288
輸入/輸出數(shù): 246
門數(shù): 69000
電源電壓: 3 V ~ 3.6 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 484-BGA
供應(yīng)商設(shè)備封裝: 484-FBGA(23x23)
36
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
SameFrame
Pin-Outs
FLEX 10KE devices support the SameFrame pin-out feature for
FineLine BGA packages. The SameFrame pin-out feature is the
arrangement of balls on FineLine BGA packages such that the lower-ball-
count packages form a subset of the higher-ball-count packages.
SameFrame pin-outs provide the flexibility to migrate not only from
device to device within the same package, but also from one package to
another. A given printed circuit board (PCB) layout can support multiple
device density/package combinations. For example, a single board layout
can support a range of devices from an EPF10K10A device in a 256-pin
FineLine BGA package to an EPF10K100A device in a 484-pin
FineLine BGA package.
The Altera software provides support to design PCBs with SameFrame
pin-out devices. Devices can be defined for present and future use. The
Altera software generates pin-outs describing how to lay out a board to
take advantage of this migration (see Figure 16).
Figure 16. SameFrame Pin-Out Example
Designed for 484-PinFineLine BGA Package
Printed Circuit Board
256-Pin FineLine BGA Package
(Reduced I/O Count or
Logic Requirements)
484-Pin FineLine BGA Package
(Increased I/O Count or
Logic Requirements)
256-Pin
FineLine
BGA
484-Pin
FineLine
BGA
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EPF10K30AFC484-2 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 216 LABs 246 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K30AFC484-3 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 216 LABs 246 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K30AFI256-2 制造商:Rochester Electronics LLC 功能描述:- Bulk
EPF10K30AQC208-1 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 216 LABs 147 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K30AQC208-1N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 216 LABs 147 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256