參數(shù)資料
型號(hào): EPF10K30EQC208-3
廠商: Altera
文件頁(yè)數(shù): 32/100頁(yè)
文件大?。?/td> 0K
描述: IC FLEX 10KE FPGA 30K 208-PQFP
產(chǎn)品培訓(xùn)模塊: Three Reasons to Use FPGA's in Industrial Designs
標(biāo)準(zhǔn)包裝: 72
系列: FLEX-10KE®
LAB/CLB數(shù): 216
邏輯元件/單元數(shù): 1728
RAM 位總計(jì): 24576
輸入/輸出數(shù): 147
門(mén)數(shù): 119000
電源電壓: 2.375 V ~ 2.625 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 208-BFQFP
供應(yīng)商設(shè)備封裝: 208-PQFP(28x28)
其它名稱: 544-1266
Altera Corporation
37
FLEX 10KE Embedded Programmable Logic Devices Data Sheet
SameFrame
Pin-Outs
FLEX 10KE devices support the SameFrame pin-out feature for
FineLine BGA packages. The SameFrame pin-out feature is the
arrangement of balls on FineLine BGA packages such that the lower-ball-
count packages form a subset of the higher-ball-count packages.
SameFrame pin-outs provide the flexibility to migrate not only from
device to device within the same package, but also from one package to
another. A given printed circuit board (PCB) layout can support multiple
device density/package combinations. For example, a single board layout
can support a range of devices from an EPF10K30E device in a 256-pin
FineLine BGA package to an EPF10K200S device in a 672-pin
FineLine BGA package.
The Altera software provides support to design PCBs with SameFrame
pin-out devices. Devices can be defined for present and future use. The
Altera software generates pin-outs describing how to lay out a board to
take advantage of this migration (see Figure 18).
Figure 18. SameFrame Pin-Out Example
Designed for 672-Pin FineLine BGA Package
Printed Circuit Board
256-Pin FineLine BGA Package
(Reduced I/O Count or
Logic Requirements)
672-Pin FineLine BGA Package
(Increased I/O Count or
Logic Requirements)
100-Pin
FineLine
BGA
256-Pin
FineLine
BGA
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EPF10K30EQI208-1DX 制造商:未知廠家 制造商全稱:未知廠家 功能描述:ASIC
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EPF10K30EQI208-2DX 制造商:未知廠家 制造商全稱:未知廠家 功能描述:ASIC