參數(shù)資料
型號(hào): EPF6024ABI256-2
廠商: Altera
文件頁(yè)數(shù): 12/52頁(yè)
文件大?。?/td> 0K
描述: IC FLEX 6000 FPGA 24K 256-BGA
標(biāo)準(zhǔn)包裝: 40
系列: FLEX 6000
LAB/CLB數(shù): 196
邏輯元件/單元數(shù): 1960
輸入/輸出數(shù): 218
門數(shù): 24000
電源電壓: 3 V ~ 3.6 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 256-BBGA
供應(yīng)商設(shè)備封裝: 256-BGA(27x27)
2
Altera Corporation
FLEX 6000 Programmable Logic Device Family Data Sheet
...and More
Features
Powerful I/O pins
Individual tri-state output enable control for each pin
Programmable output slew-rate control to reduce switching
noise
Fast path from register to I/O pin for fast clock-to-output time
Flexible interconnect
–FastTrack Interconnect continuous routing structure for fast,
predictable interconnect delays
Dedicated carry chain that implements arithmetic functions such
as fast adders, counters, and comparators (automatically used by
software tools and megafunctions)
Dedicated cascade chain that implements high-speed, high-fan-
in logic functions (automatically used by software tools and
megafunctions)
Tri-state emulation that implements internal tri-state networks
Four low-skew global paths for clock, clear, preset, or logic
signals
Software design support and automatic place-and-route provided by
Altera’s development system for Windows-based PCs, Sun
SPARCstations, and HP 9000 Series 700/800
Flexible package options
Available in a variety of packages with 100 to 256 pins, including
the innovative FineLine BGATM packages (see Table 2)
–SameFrameTM pin-compatibility (with other FLEX 6000 devices)
across device densities and pin counts
Thin quad flat pack (TQFP), plastic quad flat pack (PQFP), and
ball-grid array (BGA) packages (see Table 2)
Footprint- and pin-compatibility with other FLEX 6000 devices
in the same package
Additional design entry and simulation support provided by
EDIF 2 0 0 and 3 0 0 netlist files, the library of parameterized modules
(LPM), Verilog HDL, VHDL, DesignWare components, and other
interfaces to popular EDA tools from manufacturers such as
Cadence, Exemplar Logic, Mentor Graphics, OrCAD, Synopsys,
Synplicity, VeriBest, and Viewlogic
Table 2. FLEX 6000 Package Options & I/O Pin Count
Device
100-Pin
TQFP
100-Pin
FineLine BGA
144-Pin
TQFP
208-Pin
PQFP
240-Pin
PQFP
256-Pin
BGA
256-pin
FineLine BGA
EPF6010A
71
102
EPF6016
117
171
199
204
EPF6016A
81
117
171
EPF6024A
117
171
199
218
219
相關(guān)PDF資料
PDF描述
AMM28DTBT CONN EDGECARD 56POS R/A .156 SLD
EPF6016AQI208-2 IC FLEX 6000 FPGA 16K 208-PQFP
AMM28DTAT CONN EDGECARD 56POS R/A .156 SLD
ABC60DRYI-S734 CONN EDGECARD 120PS DIP .100 SLD
EP20K200FC484-3V IC APEX 20KE FPGA 200K 484-BGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EPF6024AFC256-1 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 6000 196 LABs 219 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF6024AFC256-2 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 6000 196 LABs 219 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF6024AFC256-2AA 制造商:Rochester Electronics LLC 功能描述:- Bulk
EPF6024AFC256-3 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 6000 196 LABs 219 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF6024AFI256-2 功能描述:IC FLEX 6000 FPGA 24K 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:FLEX 6000 產(chǎn)品變化通告:XC4000(E,L) Discontinuation 01/April/2002 標(biāo)準(zhǔn)包裝:24 系列:XC4000E/X LAB/CLB數(shù):100 邏輯元件/單元數(shù):238 RAM 位總計(jì):3200 輸入/輸出數(shù):80 門數(shù):3000 電源電壓:4.5 V ~ 5.5 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:120-BCBGA 供應(yīng)商設(shè)備封裝:120-CPGA(34.55x34.55)