參數(shù)資料
型號(hào): EPF6024ABI256-2
廠商: Altera
文件頁數(shù): 32/52頁
文件大小: 0K
描述: IC FLEX 6000 FPGA 24K 256-BGA
標(biāo)準(zhǔn)包裝: 40
系列: FLEX 6000
LAB/CLB數(shù): 196
邏輯元件/單元數(shù): 1960
輸入/輸出數(shù): 218
門數(shù): 24000
電源電壓: 3 V ~ 3.6 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 256-BBGA
供應(yīng)商設(shè)備封裝: 256-BGA(27x27)
38
Altera Corporation
FLEX 6000 Programmable Logic Device Family Data Sheet
Tables 19 through 21 describe the FLEX 6000 internal timing
microparameters, which are expressed as worst-case values. Using hand
calculations, these parameters can be used to estimate design
performance. However, before committing designs to silicon, actual
worst-case performance should be modeled using timing simulation and
timing analysis. Tables 22 and 23 describe FLEX 6000 external timing
parameters.
Table 19. LE Timing Microparameters
Symbol
Parameter
Conditions
tREG_TO_REG
LUT delay for LE register feedback in carry chain
tCASC_TO_REG
Cascade-in to register delay
tCARRY_TO_REG
Carry-in to register delay
tDATA_TO_REG
LE input to register delay
tCASC_TO_OUT
Cascade-in to LE output delay
tCARRY_TO_OUT
Carry-in to LE output delay
tDATA_TO_OUT
LE input to LE output delay
tREG_TO_OUT
Register output to LE output delay
tSU
LE register setup time before clock; LE register recovery time after
asynchronous clear
tH
LE register hold time after clock
tCO
LE register clock-to-output delay
tCLR
LE register clear delay
tC
LE register control signal delay
tLD_CLR
Synchronous load or clear delay in counter mode
tCARRY_TO_CARRY Carry-in to carry-out delay
tREG_TO_CARRY
Register output to carry-out delay
tDATA_TO_CARRY
LE input to carry-out delay
tCARRY_TO_CASC
Carry-in to cascade-out delay
tCASC_TO_CASC
Cascade-in to cascade-out delay
tREG_TO_CASC
Register-out to cascade-out delay
tDATA_TO_CASC
LE input to cascade-out delay
tCH
LE register clock high time
tCL
LE register clock low time
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EPF6024AFC256-1 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 6000 196 LABs 219 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF6024AFC256-2 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 6000 196 LABs 219 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF6024AFC256-2AA 制造商:Rochester Electronics LLC 功能描述:- Bulk
EPF6024AFC256-3 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 6000 196 LABs 219 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF6024AFI256-2 功能描述:IC FLEX 6000 FPGA 24K 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:FLEX 6000 產(chǎn)品變化通告:XC4000(E,L) Discontinuation 01/April/2002 標(biāo)準(zhǔn)包裝:24 系列:XC4000E/X LAB/CLB數(shù):100 邏輯元件/單元數(shù):238 RAM 位總計(jì):3200 輸入/輸出數(shù):80 門數(shù):3000 電源電壓:4.5 V ~ 5.5 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:120-BCBGA 供應(yīng)商設(shè)備封裝:120-CPGA(34.55x34.55)