TA = 25°C, unless otherwis" />
參數資料
型號: EVAL-AD5282EBZ
廠商: Analog Devices Inc
文件頁數: 24/28頁
文件大?。?/td> 0K
描述: BOARD EVALUATION FOR AD5282
標準包裝: 1
主要目的: 數字電位器
嵌入式:
已用 IC / 零件: AD5282
主要屬性: 2 通道,256 位置
次要屬性: I²C 接口
已供物品:
AD5280/AD5282
Rev. C | Page 5 of
28
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 2.
Parameter
Rating
VDD to GND
0.3 V to +16.5 V
VSS to GND
0 V to 7 V
VDD to VSS
16.5 V
VA, VB, VW to GND
VSS to VDD
AX to BX, AX to WX, BX to WX
Intermittent1
±20 mA
Continuous
±5 mA
VLOGIC to GND
0 V to 7 V
Output Voltage to GND
0 V to 7 V
Operating Temperature Range
40°C to +85°C
Maximum Junction Temperature (TJMAX)
150°C
Storage Temperature Range
65°C to +150°C
Reflow Soldering
Peak Temperature
260°C
Time at Peak Temperature
20 sec to 40 sec
1 Maximum terminal current is bound by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum
applied voltage across any two of the A, B, and W terminals at a given
resistance.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages. Package
power dissipation = (TJMAX TA)/ θJA .
Table 3. Thermal Resistance
Package Type
θJA
Unit
TSSOP-14
206
°C/W
TSSOP-16
150
°C/W
ESD CAUTION
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