AD5821
Rev. 0 | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter
Rating
VDD to AGND
–0.3 V to +5.5 V
VDD to DGND
–0.3 V to VDD + 0.3 V
AGND to DGND
–0.3 V to +0.3 V
SCL, SDA to DGND
–0.3 V to VDD + 0.3 V
XSHUTDOWN to DGND
–0.3 V to VDD + 0.3 V
ISINK to AGND
–0.3 V to VDD + 0.3 V
Operating Temperature Range
Industrial (B Version)
30°C to +85°C
Storage Temperature Range
65°C to +150°C
Junction Temperature (TJ MAX)
150°C
WLFCSP Power Dissipation
(TJ MAX TA)/θJA
Mounted on 4-Layer Board
95°C/W
Lead Temperature, Soldering
Maximum Peak Reflow Temperatur
e2260°C (±5°C)
1 To achieve the optimum θJA, it is recommended that the AD5821
be soldered on a 4-layer board.
2 As per JEDEC J-STD-020C.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION