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參數(shù)資料
| 型號(hào)： | EVAL-ADMP504Z-FLEX |
| 廠商： | Analog Devices Inc |
| 文件頁(yè)數(shù)： | 13/13頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | EVAL BOARD FOR ADMP504 |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | iMEMS® |
| 主要目的： | 音頻，MEMS 全向麥克風(fēng) |
| 嵌入式： | 否 |
| 已用 IC / 零件： | * |
| 主要屬性： | 模擬輸出，200 歐姆阻抗 |
| 已供物品： | 板 |
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ADMP504
Data Sheet
Rev. A | Page 8 of 12
HANDLING INSTRUCTIONS
PICK-AND-PLACE EQUIPMENT
The MEMS microphone can be handled using standard pick-
and-place and chip shooting equipment. Take care to avoid
damage to the MEMS microphone structure as follows:
Use a standard pickup tool to handle the microphone.
Because the microphone hole is on the bottom of the
package, the pickup tool can make contact with any part
of the lid surface.
Use care during pick-and-place to ensure that no high
shock events above 10 kg are experienced because this may
cause damage to the microphone.
Do not pick up the microphone with a vacuum tool that
makes contact with the bottom side of the microphone.
Do not pull air out or blow air into the microphone port.
Do not use excessive force to place the microphone
on the PCB.
REFLOW SOLDER
For best results, the soldering profile should be in accordance
with the recommendations of the manufacturer of the solder
paste used to attach the MEMS microphone to the PCB. It is
recommended that the solder reflow profile not exceed the
limit conditions specified in Figure 3 and Table 3.
BOARD WASH
When washing the PCB, ensure that water does not make
contact with the microphone port. Blow-off procedures and
ultrasonic cleaning must not be used.
OBSOLETE
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