參數(shù)資料
型號: EX256-TQG100A
廠商: Microsemi SoC
文件頁數(shù): 1/48頁
文件大小: 0K
描述: IC FPGA ANTIFUSE 12K 100-TQFP
標準包裝: 90
系列: EX
邏輯元件/單元數(shù): 512
輸入/輸出數(shù): 81
門數(shù): 12000
電源電壓: 2.3 V ~ 2.7 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 125°C
封裝/外殼: 100-LQFP
供應(yīng)商設(shè)備封裝: 100-TQFP(14x14)
Revision 10
October 2012
I
2012 Microsemi Corporation
eX Family FPGAs
Leading Edge Performance
240 MHz System Performance
350 MHz Internal Performance
3.9 ns Clock-to-Out (Pad-to-Pad)
Specifications
3,000 to 12,000 Available System Gates
Maximum 512 Flip-Flops (Using CC Macros)
0.22 m CMOS Process Technology
Up to 132 User-Programmable I/O Pins
Features
High-Performance, Low-Power Antifuse FPGA
LP/Sleep Mode for Additional Power Savings
Advanced Small-Footprint Packages
Hot-Swap Compliant I/Os
Single-Chip Solution
Nonvolatile
Live on Power-Up
No Power-Up/Down Sequence Required for Supply
Voltages
Configurable Weak-Resistor Pull-Up or Pull-Down for
Tristated Outputs during Power-Up
Individual Output Slew Rate Control
2.5 V, 3.3 V, and 5.0 V Mixed-Voltage Operation with
5.0V Input Tolerance and 5.0V Drive Strength
Software Design Support with Microsemi Designer and
Libero Integrated Design Environment (IDE) Tools
Up to 100% Resource Utilization with 100% Pin Locking
Deterministic Timing
Unique In-System Diagnostic and Verification Capability
with Silicon Explorer II
Boundary Scan Testing in Compliance with IEEE
Standard 1149.1 (JTAG)
Fuselock Secure Programming Technology Designed
to Prevent Reverse Engineering and Design Theft
Product Profile
Device
eX64
eX128
eX256
Capacity
System Gates
Typical Gates
3,000
2,000
6,000
4,000
12,000
8,000
Register Cells
Dedicated Flip-Flops
Maximum Flip-Flops
64
128
256
512
Combinatorial Cells
128
256
512
Maximum User I/Os
84
100
132
Global Clocks
Hardwired
Routed
1
2
1
2
1
2
Speed Grades
–F, Std, –P
Temperature Grades*
C, I, A
Package (by pin count)
TQ
64, 100
100
Note: *Refer to the eX Automotive Family FPGAs datasheet for details on automotive temperature offerings.
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