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參數(shù)資料
| 型號(hào)： | EX64-TQG100 |
| 廠商： | Microsemi SoC |
| 文件頁數(shù)： | 38/48頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC FPGA ANTIFUSE 3K 100-TQFP |
| 標(biāo)準(zhǔn)包裝： | 90 |
| 系列： | EX |
| 邏輯元件/單元數(shù)： | 128 |
| 輸入/輸出數(shù)： | 56 |
| 門數(shù)： | 3000 |
| 電源電壓： | 2.3 V ~ 2.7 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | 0°C ~ 70°C |
| 封裝/外殼： | 100-LQFP |
| 供應(yīng)商設(shè)備封裝： | 100-TQFP（14x14） |
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Revision 10
3-1
3 – Datasheet Information
List of Changes
The following table lists critical changes that were made in the current version of the document.
Revision
Changes
Page
Revision 10
(October 2012)
The "User Security" section was revised to clarify that although no existing security
measures can give an absolute guarantee, Microsemi FPGAs implement industry
standard security (SAR 34677).
Package names used in the "Product Profile" section and "Package Pin Assignments"
section were revised to match standards given in Package Mechanical Drawings (SAR
34779).
Revision 9
(June 2011)
The versioning system for datasheets has been changed. Datasheets are assigned a
revision number that increments each time the datasheet is revised. The "eX Device
Status" table indicates the status for each device in the device family.
The Chip Scale packages (CS49, CS128, CS181) are no longer offered for eX devices.
They have been removed from the product family information. Pin tables for CSP
packages have been removed from the datasheet (SAR 32002).
N/A
Revision 8
(v4.3, June 2006)
The "Ordering Information" was updated with RoHS information. The TQFP
measurement was also updated.
The "Dedicated Test Mode" was updated.
Note 5 was added to the "3.3 V LVTTL Electrical Specifications" and "5.0 V TTL
Electrical Specifications" tables
The "LP Low Power Pin" description was updated.
Revision 7
(v4.2, June 2004)
The "eX Timing Model" was updated.
v4.1
The "Development Tool Support" section was updated.
The "Package Thermal Characteristics" section was updated.
v4.0
The "Product Profile" section was updated.
The "Ordering Information" section was updated.
The "Temperature Grade Offerings" section is new.
The "eX FPGA Architecture and Characteristics" section was updated.
The "Clock Resources" section was updated.
The "User Security" section was updated.
The "I/O Modules" section was updated.
The "Hot-Swapping" section was updated.
The "Power Requirements" section was updated.
The "Low Power Mode" section was updated.
The "Boundary Scan Testing (BST)" section was updated.
The "Dedicated Test Mode" section was updated.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| EX64-TQG100A | 功能描述:IC FPGA ANTIFUSE 3K 100-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:EX 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14） |
| EX64-TQG100I | 功能描述:IC FPGA ANTIFUSE 3K 100-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:EX 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14） |
| EX64-TQG100PP | 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:eX Family FPGAs |
| EX64-TQG64 | 功能描述:IC FPGA ANTIFUSE 3K 64-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:EX 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14） |
| EX64-TQG64A | 功能描述:IC FPGA ANTIFUSE 3K 64-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:EX 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14） |
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