參數(shù)資料
型號: FT232R
廠商: Electronic Theatre Controls, Inc.
英文描述: Incorporating Clock Generator Output and FTDIChip-ID Security Dongle
中文描述: 納入時鐘發(fā)生器輸出和FTDIChip標(biāo)識安全適配器
文件頁數(shù): 15/29頁
文件大小: 471K
代理商: FT232R
FT232R USB UART I.C. Datasheet Version 1.04
Future Technology Devices International Ltd. 2005
Page 15
5.5 Solder Reflow Profile
Critical Zone: when
T is in the range
T to T
L
T
Time, t (seconds)
25
T = 25
o
C to T
t
p
T
p
T
L
t
Preheat
t
L
Ramp Up
p
Ramp
Down
T Max
T Min
S
Figure 10 - FT232R Solder Reflow Profile
The recommended values for the solder reflow profile are detailed in Table 4. Values are shown for both a completely
Pb free solder process (i.e. the FT232R is used with Pb free solder), and for a non-Pb free solder process (i.e. the
FT232R is used with non-Pb free solder).
Table 4 - Reflow Profile Parameter Values
Profile Feature
Pb Free Solder Process
Non-Pb Free Solder Process
Average Ramp Up Rate (T
s
to T
p
)
3°C / second Max.
3°C / Second Max.
Preheat
- Temperature Min (T
S
Min.)
- Temperature Max (T
Max.)
- Time (t
S
Min to t
S
Max)
Time Maintained Above Critical Temperature T
L
:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
150°C
200°C
60 to 120 seconds
100°C
150°C
60 to 120 seconds
217°C
60 to 150 seconds
183°C
60 to 150 seconds
260°C
240°C
Time within 5°C of actual Peak Temperature (t
P
)
20 to 40 seconds
20 to 40 seconds
Ramp Down Rate
6°C / second Max.
6°C / second Max.
Time for T= 25°C to Peak Temperature, T
p
8 minutes Max.
6 minutes Max.
The FT232R is supplied in Pb free 28 LD SSOP and QFN-32 packages. The recommended solder reflow profile for
both package options is shown in Figure 10.
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