參數(shù)資料
型號: FW330S3R671-56
元件分類: 電源模塊
英文描述: 1-OUTPUT 330 W DC-DC REG PWR SUPPLY MODULE
封裝: 2.40 X 4.60 INCH, 0.57 INCH HEIGHT, POWER MODULE
文件頁數(shù): 14/29頁
文件大?。?/td> 347K
代理商: FW330S3R671-56
20
Tyco Electronics Corp.
Advance Data Sheet
March 2000
36 to 75 Vdc Input, 3.6, 3.3, 2.5, 2.0, or 1.8 Vdc Output; 180 W to 330 W
FW330 Power Modules: dc-dc Converters;
Thermal Considerations (continued)
Heat Transfer with Heat Sinks (continued)
Figures 32 and 33 can be used to predict which heat
sink a module will require in a natural convection envi-
ronment.
For example when a module is transversely oriented in
a 20 °C ambient and dissipates 50 W, then a 1.5 in.
heat sink is required.
Thermal derating with heat sinks is expressed by using
the overall thermal resistance of the module. Total mod-
ule thermal resistance (
θca) is dened as the maximum
case temperature rise (
TC, max) divided by the module
power dissipation (PD):
The location to measure case temperature (TC) is
shown in Figure 29. Case-to-ambient thermal resis-
tance vs. airow for various heat sink congurations is
shown in Figure 34 and 35. These curves were
obtained by experimental testing of heat sinks, which
are offered in the product catalog.
8-2610 (C)
Figure 34. Case-to-Ambient Thermal Resistance
Curves; Transverse Orientation
8-2611(C)
Figure 35. Case-to-Ambient Thermal Resistance
Curves; Longitudinal Orientation
These measured resistances are from heat transfer
from the sides and bottom of the module as well as the
top side with the attached heat sink; therefore, the
case-to-ambient thermal resistances shown are gener-
ally lower than the resistance of the heat sink by itself.
The module used to collect the data in Figures 34 and
35 had a thermal-conductive dry pad between the case
and the heat sink to minimize contact resistance.
To choose a heat sink, determine the power dissipated
as heat by the unit for the particular application.
Figures 37 through 40 show typical heat dissipation for
a range of output currents and three voltages for the
FW330 modules.
8-3016 (F)
Figure 36. FW330S3R671-56 Power Dissipation vs.
Output Current at 25 °C
θca
TC max
,
PD
---------------------
TC
TA
()
PD
------------------------
==
3.5
1.0
0.0
2.0
3.0
4.0
0.5
1.5
2.5
1.0
(200)
2.0
(400)
3.0
(600)
0.0
(0)
AIR VELOCITY, m/s (ft./min.)
NO HEAT SINK
1/4 IN. HEAT SINK
1/2 IN. HEAT SINK
1 IN. HEAT SINK
1 1/2 IN. HEAT SINK
RESISTANCE,
Θ
CA
(
°CW)
3.5
1.0
0.0
2.0
3.0
4.0
0.5
1.5
2.5
1.0
(200)
2.0
(400)
3.0
(600)
0.0
(0)
AIR VELOCITY, m/s (ft./min.)
NO HEAT SINK
1/4 IN. HEAT SINK
1/2 IN. HEAT SINK
1 IN. HEAT SINK
1 1/2 IN. HEAT SINK
RESISTANCE,
Θ
CA
(
°CW)
90
70
60
50
40
30
20
10
0
91929394959697989
99
80
OUTPUT CURRENT, IO (A)
POWER
DISSIPATION,
P
D
(W)
VI = 75 V
VI = 36 V
VI = 48 V
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