www.bergquistcompany.com
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and
THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED
WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers’ and manufacturers’ only obligation shall be to
replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product
for its intended use, and the user assumes all risks and liability whatsoever in connection therewith. NEITHER SELLER NOR
MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT,
INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR
THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not
contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.
PDS_GP_1000SF_12.08
The Bergquist Company -
North American Headquarters
18930 West 78th Street
Chanhassen, MN 55317
Phone: 800-347-4572
Fax: 952-835-0430
The Bergquist Company -
European Headquarters
Bramenberg 9a, 3755 BT Eemnes
Netherlands
Phone: 31-35-5380684
Fax: 31-35-5380295
The Bergquist Company - Asia
Room 15, 8/F Wah Wai Industrial Centre
No. 38-40, Au Pui Wan Street
Fotan, Shatin, N.T. Hong Kong
Ph: 852.2690.9296
Fax: 852.2690.2344
Gap Pad 1000SF
Thermally Conductive, Silicone-Free Gap Filling Material
Gap Pad
: U.S. Patent 5,679,457 and others
Features and Benefits
Thermal conductivity: 0.9 W/m-K
No silicone outgassing
No silicone extraction
Reduced tack on one side to aid in
application assembly
Electrically isolating
The new Gap Pad 1000SF is a thermally
conductive, electrically insulating, silicone-
free polymer specially designed for
silicone-sensitive applications.The material
is ideal for applications with high standoff
and flatness tolerances. Gap Pad 1000SF is
reinforced for easy material handling and
added durability during assembly.The
material is available with a protective liner
on both sides of the material.The topside has
reduced tack for ease of handling.
Note: Resultant thickness is defined as the final gap
thickness of the application.
012
4
35
125
100
75
50
25
0
Thickness vs. Thermal Resistance
Gap Pad 1000SF
Thermal Resistance (C-in2/W)
Resultant
Thickness
(mils)
Typical Applications Include:
Digital disk drives / CD-ROM
Automotive modules
Fiber optics modules
Configurations Available:
Sheet form
Die-cut parts
Building a Part Number
Standard Options
Section
A
Section
B
Section
C
Section
D
Section
E
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
GP1000SF = Gap Pad 1000SF Material
GP1000SF
0.010
02
0816
NA
Note: To build a part number, visit our website at www.bergquistcompany.com.
Standard thicknesses available: 0.010", 0.015", 0.020",
0.040", 0.060", 0.080", 0.100", 0.125"
02 = Natural tack, both sides
0806: = Standard sheet size 8" x 16", or
00 = custom configuration
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–
TYPICAL PROPERTIES OF GAP PAD 1000SF
PROPERTY
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Color
Green
Visual
Reinforcement Carrier
Fiberglass
—
Thickness (inch) / (mm)
0.010 to 0.125
0.254 to 3.175
ASTM D374
Inherent Surface Tack (1- or 2-sided)
2
—
Density (g/cc)
2.0
ASTM D792
Heat Capacity (J/g-K)
1.1
ASTM E1269
Hardness, Bulk Rubber (Shore 00) (1)
40
ASTM D2240
Young’s Modulus (psi) / (kPa) (2)
34
234
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 257
-60 to 125
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
>6000
ASTM D149
Dielectric Constant (1000 Hz)
5.0
ASTM D150
Volume Resistivity (Ohm-meter)
1010
ASTM D257
Flame Rating
V-1
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
0.9
ASTM D5470
1) Thirty second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.