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參數(shù)資料
| 型號： | HA4P5002-5Z |
| 廠商： | Intersil |
| 文件頁數(shù)： | 4/12頁 |
| 文件大小： | 0K |
| 描述： | IC BUFFER 110MHZ HIGH OUT 20PLCC |
| 標準包裝： | 46 |
| 放大器類型： | 緩沖器 |
| 電路數(shù)： | 1 |
| 轉換速率： | 1300 V/µs |
| -3db帶寬： | 110MHz |
| 電流 - 輸入偏壓： | 2µA |
| 電壓 - 輸入偏移： | 5000µV |
| 電流 - 電源： | 8.3mA |
| 電流 - 輸出 / 通道： | 220mA |
| 電壓 - 電源，單路/雙路(±)： | 10 V ~ 40 V，±5 V ~ 20 V |
| 工作溫度： | 0°C ~ 75°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 20-LCC（J 形引線） |
| 供應商設備封裝： | 20-PLCC |
| 包裝： | 管件 |
12
FN2921.12
October 18, 2013
HA-5002
Package Outline Drawing
M8.15
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 1/12
DETAIL "A"
TOP VIEW
INDEX
AREA
12
3
-C-
SEATING PLANE
x 45°
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M-1994.
2. Package length does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
3. Package width does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
5. Terminal numbers are shown for reference only.
6. The lead width as measured 0.36mm (0.014 inch) or greater above the
seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch).
7. Controlling dimension: MILLIMETER. Converted inch dimensions are not
necessarily exact.
8. This outline conforms to JEDEC publication MS-012-AA ISSUE C.
SIDE VIEW “A
SIDE VIEW “B”
1.27 (0.050)
6.20 (0.244)
5.80 (0.228)
4.00 (0.157)
3.80 (0.150)
0.50 (0.20)
0.25 (0.01)
5.00 (0.197)
4.80 (0.189)
1.75 (0.069)
1.35 (0.053)
0.25(0.010)
0.10(0.004)
0.51(0.020)
0.33(0.013)
8°
0°
0.25 (0.010)
0.19 (0.008)
1.27 (0.050)
0.40 (0.016)
1.27 (0.050)
5.20(0.205)
1
2
3
4
5
6
7
8
TYPICAL RECOMMENDED LAND PATTERN
2.20 (0.087)
0.60 (0.023)
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