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參數(shù)資料
| 型號(hào)： | HC5513BIM |
| 廠商： | Intersil |
| 文件頁(yè)數(shù)： | 6/20頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC SLIC DLC/FLC LP STDBY 22-DIP |
| 標(biāo)準(zhǔn)包裝： | 37 |
| 系列： | UniSLIC14 |
| 功能： | 用戶線路接口概念（SLIC） |
| 電路數(shù)： | 1 |
| 電流 - 電源： | 2.25mA |
| 功率（瓦特）： | 1.5W |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 通孔 |
| 封裝/外殼： | 22-DIP（0.400"，10.16mm） |
| 供應(yīng)商設(shè)備封裝： | 22-PDIP |
| 包裝： | 管件 |
| 包括： | 接地鍵檢測(cè)器，可編程回路電流檢測(cè)器，振鈴?fù)禉z測(cè)器，熱關(guān)機(jī) |
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14
AC Transmission Circuit Stability
To ensure stability of the AC transmission feedback loop two
compensation capacitors CTC and CRC are required.
Figure 21 (Application Circuit) illustrates their use.
Recommended value is 2200pF.
AC-DC Separation Capacitor, CHP
The high pass filter capacitor connected between pins HPT
and HPR provides the separation between circuits sensing
tip to ring DC conditions and circuits processing AC signals.
A 10nf CHP will position the low end frequency response
3dB break point at 48Hz. Where:
Where RHP = 330k.
Thermal Shutdown Protection
The HC5513’s thermal shutdown protection is invoked if a
fault condition on the tip or ring causes the temperature of
the die to exceed 160oC. If this happens, the SLIC goes into
a high impedance state and will remain there until the
temperature of the die cools down by about 20oC. The SLIC
will return back to its normal operating mode, providing the
fault condition has been removed.
Surge Voltage Protection
The HC5513 must be protected against surge voltages and
power crosses. Refer to “Maximum Ratings” TIPX and
RINGX terminals for maximum allowable transient tip and
ring voltages. The protection circuit shown in Figure 21
utilizes diodes together with a clamping device to protect tip
and ring against high voltage transients.
Positive transients on tip or ring are clamped to within a
couple of volts above ground via diodes D1 and D2. Under
normal operating conditions D1 and D2 are reverse biased
and out of the circuit.
Negative transients on tip and ring are clamped to within a
couple of volts below ground via diodes D3 and D4 with the
help of a Surgector. The Surgector is required to block
conduction through diodes D3 and D4 under normal
operating conditions and allows negative surges to be
returned to system ground.
The fuse resistors (RF) serve a dual purpose of being
nondestructive power dissipaters during surge and fuses
when the line in exposed to a power cross.
Power-Up Sequence
The HC5513 has no required power-up sequence. This is a
result of the Dielectrically Isolated (DI) process used in the
fabrication of the part. By using the DI process, care is no
longer required to insure that the substrate be kept at the
most negative potential as with junction isolated ICs.
Printed Circuit Board Layout
Care in the printed circuit board layout is essential for proper
operation. All connections to the RSN pin should be made as
close to the device pin as possible, to limit the interference
that might be injected into the RSN terminal. It is good
practice to surround the RSN pin with a ground plane.
FIGURE 20A.
FIGURE 20B.
FIGURE 20. LONGITUDINAL IMPEDANCE NETWORK
TIP
RING
VBAT/2
GT
GR
I1
I2
IT
IR
RLARGE
VT
+
-
ILONG
HC5513
ILONG
V
R
+
-
VC
+
-
VBAT/2
VC
RLARGE
TIP
RING
5k
5k
20
+
-
2I0
I1
I
1
GT
TIP CURRENT SOURCE
WITH DIFFERENTIAL INPUTS
TIP DIFFERENTIAL
TRANSCONDUCTANCE
AMPLIFIER
3dB
1
2
π
R
HP
C
HP
()
-----------------------------------------------------
=
(EQ. 28
HC5513
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