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參數(shù)資料
| 型號(hào)： | HCS112K |
| 廠商： | Intersil Corporation |
| 英文描述： | Radiation Hardened Dual JK Flip-Flop |
| 中文描述： | 輻射加固雙JK觸發(fā)器 |
| 文件頁(yè)數(shù)： | 9/9頁(yè) |
| 文件大?。?/td> | 180K |
| 代理商： | HCS112K |
19
HCS112MS
Die Characteristics
DIE DIMENSIONS:
89 x 88 mils
2.25 x 2.24mm
METALLIZATION:
Type: SiAl
Metal Thickness: 11k
±
1k
GLASSIVATION:
Type: SiO
2
Thickness: 13k
±
2.6k
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
μ
m x 100
μ
m
4 mils x 4 mils
Metallization Mask Layout
HCS112MS
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCS112 is TA14341A.
CP1
(1)
KA
(2)
JA (3)
SA (4)
QA (5)
QA (6)
QB (7)
GND
(8)
QB
(9)
SB
(10)
(11) JB
(12) KB
(13) CPB
(14) RB
(15) RA
VCC
(16)
Spec Number
518830
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HCS112HMSR | Radiation Hardened Dual JK Flip-Flop |
| HCS125 | Radiation Hardened Quad Buffer, Three-State |
| HCS125KMSR | Radiation Hardened Quad Buffer, Three-State |
| HCS125MS | Radiation Hardened Quad Buffer, Three-State(抗輻射四緩沖器（三態(tài)）) |
| HCS125D | Radiation Hardened Quad Buffer, Three-State |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HCS112KMSR | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Dual JK Flip-Flop |
| HCS112MS | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Dual JK Flip-Flop |
| HCS114-01GG | 制造商:Advanced Interconnect 功能描述: |
| HCS11DMSR | 制造商:Intersil Corporation 功能描述:AND GATE 3-ELEM 3-IN CMOS 14PIN SBCDIP - Rail/Tube |
| HCS11KMSR | 制造商:Intersil Corporation 功能描述:AND GATE 3-ELEM 3-IN CMOS 14CFPAK - Bulk |
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