參數(shù)資料
型號: HCTS20D
廠商: Intersil Corporation
英文描述: Radiation Hardened Dual 4-Input NAND Gate
中文描述: 輻射加固雙路4輸入與非門
文件頁數(shù): 8/9頁
文件大?。?/td> 132K
代理商: HCTS20D
427
HCTS20MS
Die Characteristics
DIE DIMENSIONS:
2.20 x 2.24(mm)
METALLIZATION:
Type: SiAl
Metal Thickness: 11k
±
1k
GLASSIVATION:
Type: SiO
2
Thickness: 13k
±
2.6k
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
μ
m x 100
μ
m
4 mils x 4 mils
Metallization Mask Layout
HCTS20MS
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS20 is TA14426A.
A1
(1)
VCC
(14)
D2
(13)
B1 (2)
NC (3)
C1 (4)
D1 (5)
(6)
Y1
(7)
GND
(8)
Y2
(9) A2
(10) B2
(11) NC
(12) C2
Spec Number
518619
相關(guān)PDF資料
PDF描述
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HCTS20D/SAMPLE 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Dual 4-Input NAND Gate
HCTS20DMSR 制造商:Intersil Corporation 功能描述:RAD HARD DUAL 4-INPUT NAND GATE,DIP,200KRAD,TTL,CLASS V - Rail/Tube
HCTS20HMSR 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Dual 4-Input NAND Gate
HCTS20K 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Dual 4-Input NAND Gate
HCTS20K/SAMPLE 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Dual 4-Input NAND Gate