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參數(shù)資料
| 型號： | HD3-6409-9Z |
| 廠商： | Intersil |
| 文件頁數(shù)： | 5/14頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC ENCODER-DECODER CMOS 20-PDIP |
| 標(biāo)準(zhǔn)包裝： | 180 |
| 類型： | 解碼器 |
| 應(yīng)用： | 光纖 |
| 安裝類型： | 通孔 |
| 封裝/外殼： | 20-DIP（0.300"，7.62mm） |
| 供應(yīng)商設(shè)備封裝： | 20-PDIP |
| 包裝： | 管件 |
13
FN2951.3
October 15, 2008
HD-6409
Dual-In-Line Plastic Packages (PDIP)
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English
and Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in
JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and
are measured with the leads constrained to be perpen-
dicular to datum
.
7. eB and eC are measured at the lead tips with the leads uncon-
strained. eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dam-
bar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
eA
-C-
CL
E
eA
C
eB
eC
-B-
E1
INDEX
12 3
N/2
N
AREA
SEATING
BASE
PLANE
-C-
D1
B1
B
e
D
D1
A
A2
L
A1
-A-
0.010 (0.25)
C A
M
BS
E20.3 (JEDEC MS-001-AD ISSUE D)
20 LEAD DUAL-IN-LINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.210
-
5.33
4
A1
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
B1
0.045
0.070
1.55
1.77
8
C
0.008
0.014
0.204
0.355
-
D
0.980
1.060
24.89
26.9
5
D1
0.005
-
0.13
-
5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
2.54 BSC
-
eA
0.300 BSC
7.62 BSC
6
eB
-
0.430
-
10.92
7
L
0.115
0.150
2.93
3.81
4
N20
20
9
Rev. 0 12/93
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