8
FN2951.3
October 15, 2008
Common Electrical Specifications
Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified.
Temperature limits established by characterization and are not production tested.
Absolute Maximum Ratings
Thermal Information
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.0V
Input, Output or I/O Voltage . . . . . . . . . . . . GND -0.5V to VCC +0.5V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Operating Conditions
Operating Temperature Range . . . . . . . . . . . . . . . . .-40°C to +85°C
Operating Voltage Range. . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V
Input Rise and Fall Times . . . . . . . . . . . . . . . . . . . . . . . . . 50ns Max
Sync. Transition Span (t2) . . . . . . . . . .1.5 DBP Typical, (Notes
1, 2)Short Data Transition Span (t4) . . . . . . 0.5DBP Typical, (Notes
1, 2)
Long Data Transition Span (t5) . . . . . . 1.0DBP Typical, (Notes
1, 2)
Zero Crossing Tolerance (tCD5) . . . . . . . . . . . . . . . . . . . . . (Note
3)
Thermal Resistance (Typical, Note
4)θ
JA (°C/W)
θ
JC (°C/W)
PDIP Package . . . . . . . . . . . . . . . . . . .
75
N/A
SOIC Package . . . . . . . . . . . . . . . . . . .
100
N/A
Storage Temperature Range . . . . . . . . . . . . . . . . . . -65°C to +150°C
Maximum Junction Temperature
Ceramic Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175°C
Plastic Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
*Pb-free PDIPs can be used for through hole wave solder
processing only. They are not intended for use in Reflow solder
processing applications.
Die Characteristics
Gate Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .250 Gates
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1. DBP-Data Bit Period, Clock Rate = 16X, one DBP = 16 Clock Cycles; Clock Rate = 32X, one DBP = 32 Clock Cycles.
2. The input conditions specified are nominal values, the actual input waveforms transition spans may vary by
±2 I
X clock cycles (16X mode) or ±6
IX clock cycles (32X mode).
3. The maximum zero crossing tolerance is
±2 IX clock cycles (16X mode) or ±6 IX clock cycles (32 mode) from the nominal.
4.
θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
DC Electrical Specifications VCC = 5.0V ± 10%, TA = -40°C to +85°C (HD-6409-9).
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
MAX
UNITS
VIH
Logical “1” Input Voltage
VCC = 4.5V
70% VCC
-V
VIL
Logical “0” Input Voltage
VCC = 4.5V
-
20% VCC
VIHR
Logic “1” Input Voltage (Reset)VCC = 5.5V
VCC -0.5
-
V
VILR
Logic “0” Input Voltage (Reset)VCC = 4.5V
-
GND +0.5
V
VIHC
Logical “1” Input Voltage (Clock)
VCC = 5.5V
VCC -0.5
-
V
VILC
Logical “0” Input Voltage (Clock)
VCC = 4.5V
-
GND +0.5
V
II
Input Leakage Current (Except IX)VIN = VCC or GND, VCC = 5.5V
-1.0
+1.0
μA
II
Input Leakage Current (IX)VIN = VCC or GND, VCC = 5.5V
-20
+20
μA
IO
I/O Leakage Current
VOUT = VCC or GND, VCC = 5.5V
-10
+10
μA
VOH
Output HIGH Voltage (All Except OX)IOH = -2.0mA, VCC = 4.5V (Note 6) VCC -0.4
-
V
VOL
Output LOW Voltage (All Except OX)IOL = +2.0mA, VCC = 4.5V (Note 6) -
0.4
V
ICCSB
Standby Power Supply Current
VIN = VCC or GND, VCC = 5.5V,
Outputs Open
-
100
μA
ICCOP
Operating Power Supply Current
f = 16.0MHz, VIN = VCC or GND
VCC = 5.5V, CL = 50pF
-
18.0
mA
FT
Functional Test
-
NOTES:
5. Tested as follows: f = 16MHz, VIH = 70% VCC, VIL = 20% VCC, VOH ≥ VCC/2, and VOL ≤ VCC/2, VCC = 4.5V and 5.5V.
6. Interchanging of force and sense conditions is permitted
HD-6409