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參數(shù)資料
| 型號： | HDSP-x101 |
| 英文描述： | Double Hetero junction AlGaAs Red Low Current Seven Segment Displays(雙異質結鋁砷化鎵紅色低電流七段段碼顯示器) |
| 中文描述： | 雙異質結AlGaAs的紅色小電流七段顯示器（雙異質結鋁砷化鎵紅色低電流七段段碼顯示器） |
| 文件頁數(shù)： | 2/2頁 |
| 文件大?。?/td> | 32K |
| 代理商： | HDSP-X101 |
Notes:
3. The point MTBF (representing a typical MTBF) is simply the total device hours divided by the number of failures. Since no
failures occurred during the testing, the point MTBF and failure rate are calculated assuming one failure.
4. This MTBF and failure rate represent the performance level for which there is a 90% probability of the device doing better
than the stated value. This confidence level is based on the statistics of the distribution of failures. The assumed distribution
is exponential. This particular distribution is commonly used in describing useful life failures. This methodology is based on
MIL-STD-690B.
Table 3. Mechanical and E nvironmental Tests
Note:
5. With the exception of solderability and
temperature cycling, all data is generic
to seven segment display family.
Table 2. Failure Rate Prediction
Point Typical
Performance
[3]
in Time
Performance
in Time
[4]
( 90% Confidence)
Ambient
J unction
F ailure Rate
( %/1K Hours)
0.746
0.515
0.348
0.230
0.148
0.093
0.057
F ailure Rate
( %/1K Hours)
1.717
1.185
0.801
0.529
0.341
0.214
0.130
Temperature (
°
C)
85
75
65
55
45
35
25
Temperature (
°
C)
99
89
79
69
59
49
39
MTBF
[1]
134,000
194,000
287,000
435,000
675,000
1,077,000
1,769,000
MTBF
[2]
58,000
84,000
125,000
189,000
293,000
468,000
768,000
Units
Tested
197
536
536
Units
Failed
0
0
Test Name
Physical Dimensions
Solderability
Temperature
Cycling
MIL-STD-883C Ref
2016
2003.3
1010.5
Test Conditions
Device profile at 20X
Sn 60, Pb 40 Solder at 260
°
C for 5 sec.
-55 to 100
°
C, 15 min. dwell, 5 min. transfer
20 cycles
100 cycles
0
2
(0.37%)
0
0
0
Moisture Resistance
Mechanical Shock
Vibration Fatigue
1004.4
2002.3 (Cond. B)
2005.1 (Cond. A)
10 days, 90-98% RH, -10 to 65
°
C, non-operating
5 blows each X1, Y1, Y2 axis 1500 G 0.5 msec.
32
±
8 hours each X, Y, Z, 96 hours total,
60 Hz, 20 G min.
3 cycles, 4 min. for each X, Y, Z axis at 20 G.
min., 20 to 2000 Hz
1 min. each X1, Y1, Y2 at 20,000 G
392
369
190
Vibration, Variable
Frequency
Constant
Acceleration
Lead Fatigue
Terminal Strength
Solvent Resistance
2007.1 (Cond. A)
190
1
(0.53%)
0
2001.2
(Cond. D)
2004.4 (Cond. B2)
2004.4 (Cond. A)
2015.4
189
3 bends 15 degrees min.
1 lb. for 30 seconds
Solvents tested:
1/4 Isopropyl Alcohol and 3/4 mineral spirits
35
°
C for 24 hrs.
45
149
45
0
0
0
Salt Atmosphere
1009.4
50
0
www.semiconductor.agilent.com
Data subject to change.
Copyright 1999 Agilent Technologies, Inc.
5954-8454 (11/99)
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