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參數(shù)資料
| 型號： | HFBR-5303 |
| 英文描述： | 850 nm VCSEL 1x9 Transceiver(850 nm VCSEL 1x9 收發(fā)器) |
| 中文描述： | 850 nm VCSEL的1x9收發(fā)器（850 nm VCSEL的1x9收發(fā)器） |
| 文件頁數(shù)： | 1/4頁 |
| 文件大?。?/td> | 33K |
| 代理商： | HFBR-5303 |
850 nm VCSEL 1x9 Transceiver
Reliability Data
This reliability data sheet
describes a newly released
850 nm VCSEL optical transceiver
for multimode Gigabit Fiber
Channel, Ethernet and General
Purpose applications.
HFBR-5303/53D3
HFBR-5305/53D5
Failure Rate Prediction
The Demonstrated Point MTBF
given on this data sheet is on
device performance at maximum
allowed stress conditions. Tem-
perature is an alterable stress. The
1. Life Test
The following demonstrated data
represents information based
upon the High Temperature
Operating Life tests on HFBR-5305
transceivers.
Definition of Failure
Product failure has occurred when
the unit fails to respond properly
to a dc/ac functional test condi-
tion. The functional test condition
shall not exceed the absolute
maximum data sheet limits for the
product.
failure rate will have a direct
relationship to the life stress. MIL-
HDBK-217 uses, for this type of
product (hybrid packaging), a 0.43
electron volt activation energy
which represents the most conser-
vative temperature acceleration
reported. Estimates for typical
equipment use temperatures are as
follows:
Ambient
Temp.
(
°
C)
75
70
65
60
55
50
45
40
35
30
25
Point Typical
Performance
MTBF
244,000
300,000
372,000
465,000
584,000
740,000
943,000
1,210,000
1,570,000
2,050,000
2,700,000
Point Typical
Performance
FITS
4,090
3,320
2,680
2,140
1,700
1,350
1,050
824
636
487
369
60%
90%
60%
90%
Confidence
MTBF
156,700
192,900
238,900
297,700
373,600
472,200
601,100
771,200
997,000
1,301,000
1,712,000
Confidence
MTBF
91,600
113,000
140,000
174,000
219,000
278,000
354,000
455,000
590,000
771,000
1,010,000
Confidence
FITS
6,380
5,200
4,200
3,360
2,700
2,120
1,660
1,297
1,003
769
590
Confidence
FITS
10,900
8,840
7,130
5,710
4,540
3,590
2,810
2,190
1,690
1,290
983
* Failures attibuted to mechanical damage to the VCSEL die as a result of manual handling during the assembly process. Since August
1997, VCSEL transmitter assembly has been accomplished using an automatic pick and place system. No further failures of this type
have been observed.
A. Demonstrated Performance
Stress Test
Conditions
Total
Device
Hours
488,000
Total
Units
Tested
99
No. of
F ailed
Units
2*
Demonstrated Demonstrated
MTBF @
T
A
= 75
°
C
244,000
Test Name
F ITS @
T
A
= 75
°
C
–
High Temperature
Operating Life
V
CC
= 5.0 Vdc
T
A
= 75
°
C
See Note 1.
Total
488,000
2
244,000
4,098
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PDF描述 |
|---|---|
| HFBR-53D3 | 850 nm VCSEL 1x9 Transceiver(850 nm VCSEL 1x9 收發(fā)器) |
| HFBR-53D5 | 850 nm VCSEL 1x9 Transceiver(850 nm VCSEL 1x9 收發(fā)器) |
| HFBR-5305 | 850 nm VCSEL 1x9 Transceiver(850 nm VCSEL 1x9 收發(fā)器) |
| HFBR-5912E | Small Form Factor MT-RJ Fiber Optic Transceivers for Gigabit Ethernet(應(yīng)用于千兆位以太網(wǎng)的小形式MT-RJ光纖收發(fā)器) |
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