參數(shù)資料
型號(hào)： HFBR-5303
英文描述： 850 nm VCSEL 1x9 Transceiver(850 nm VCSEL 1x9 收發(fā)器)
中文描述： 850 nm VCSEL的1x9收發(fā)器（850 nm VCSEL的1x9收發(fā)器）
文件頁數(shù)： 2/4頁
文件大?。?/td> 33K
代理商： HFBR-5303
2
2. Mechanical and Environmental Tests
(Testing done on a constructional basis)
Test
Conditions
Duration
Sample Size
(HFBR-5305)
40
Failure
Temp. Cycle
-40
°
C to 100
°
C,
15 min. dwell
5 min. transfer
T
A
= 85
°
C, 85% RH,
V
cc
= +5.25 V.
(See note 1)
121
°
C, 100% RH,
2 Atm. net
Moisture Soak:
T
A
= 85
°
C, 85% RH;
Wave Soldering:
2 sec. on 260
°
C Solder;
5 min. wash in 60
°
-70
°
C
DI water under 40 psi;
20 min. bake at 70
°
C
MIL-STD-883 Method 1004,
T
A
= -10
°
C to 65
°
C,
Relative Humidity = 95%,
Power On/Off @ 30 min./
30 min. V
CC
= 5.25 V
(See note 1)
T
A
= -40
°
C, V
CC
= +5.25 V
(See note 1)
T
A
= -40
°
to 100
°
C, Liquid
to Liquid, 5 min. dwell,
10 sec. transfer
MIL-STD-883, Method
2002B, 1500 g
0.5 ms, 5 times/axis
MIL-STD-883, Method
2007A, 20 - 2000 Hz, 20 g
315
°
C - 10 sec.
T
A
= 100
°
C
200 cycles
0
85/85
Biased
1000 hours
39
0
Unbiased
Pressure pot
Popcorn Test
168 hours
20
0
Moisture Soak: 96 hours;
20
0
Wave Soldering: 3 times
Power Cycle,
Temp. Cycle &
Humidity
1000 hours
39
0
LTOL
1000 hours
11
0
Thermal Shock
100 cycles
10
0
Mechanical
Shock
11
0
Mechanical
Vibration
Hand Soldering
High Temperature
Storage
Low Temperature
Storage
Solderability
11
0
4
11
0
0
500 hours
T
A
= -40
°
C
500 hours
11
0
MIL-STD-883,
Method 2003
11
0
相關(guān)PDF資料
PDF描述
HFBR-53D3 850 nm VCSEL 1x9 Transceiver(850 nm VCSEL 1x9 收發(fā)器)
HFBR-53D5 850 nm VCSEL 1x9 Transceiver(850 nm VCSEL 1x9 收發(fā)器)
HFBR-5305 850 nm VCSEL 1x9 Transceiver(850 nm VCSEL 1x9 收發(fā)器)
HFBR-5912E Small Form Factor MT-RJ Fiber Optic Transceivers for Gigabit Ethernet(應(yīng)用于千兆位以太網(wǎng)的小形式MT-RJ光纖收發(fā)器)
HFCT-5912E Small Form Factor MT-RJ Fiber Optic Transceivers for Gigabit Ethernet(應(yīng)用于千兆位以太網(wǎng)的小形式MT-RJ光纖收發(fā)器)
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參數(shù)描述
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