2
The optical sub-assemblies utilize
a high-volume assembly process
together with low-cost lens
technical understanding
associated with this transceiver.
You can contact them through
Solder and Wash Process
Compatibility
The transceiver is delivered with
a protective process plug inserted
into the duplex SBCON connector
receptacle. This process plug
protects the optical sub-
assemblies during wave solder
and aqueous wash processing and
acts as a dust cover during
shipping. These transceivers are
compatible with either industry
standard wave or hand soldering
processes. The process plug part
number is HFBR-5002.
Shipping Container
The transceiver is packaged in a
shipping container designed to
protect it from mechanical and
ESD damage during shipment or
storage.
Board Layout -
Decoupling Circuit and
Ground Planes
It is important to take care in the
layout of your circuit board to
achieve optimum performance
from the transceiver. Figure 3
provides a good example of a
schematic for a power supply
decoupling circuit that works well
with this part. It is further
recommended that a contiguous
ground plane be provided in the
circuit board directly under the
transceiver to provide a low
inductive ground for signal return
current. This recommendation is
in keeping with good high-
frequency board layout practices.
Note:
Ultem is a registered trademark of
General Electric Corporation.
elements which result in a cost-
effective building block.
The electrical subassembly
consists of a high-volume multi-
layer printed circuit board on
which the IC circuits and various
surface-mount passive circuit
elements are attached.
The outer housing, including the
SBCON-compliant duplex
connector receptacle, is molded
of filled, non-conductive UL 94V-
0 flame retardant Ultem
plastic
(U.L. File E121562) to provide
mechanical strength and
electrical isolation.
The transceiver is attached to a
printed circuit board with 28
signal pins (4 rows of 7 pins) and
with the four slots on the flanges
which are located on the package
sides. These four slots on the
flanges provide the primary
mechanical strength to withstand
the loads imposed by the duplex
connectored fiber cables.
Applications Information
The Applications Engineering
group in the Agilent Optical
Communications Division is
available to assist you with the
your local Agilent sales
representative.
Agilent LED technology has
produced 1300 nm LED devices
with lower aging characteristics
than normally associated with
these technologies in the
industry. The industry convention
is 1.5 dB aging for 1300 nm
LEDs. The Agilent LED will
normally experience less than
half this amount of aging over
normal, commercial equipment
mission-life periods. Contact your
local Agilent sales representatives
for additional details.
Recommended Handling
Precautions
It is advised that normal, anti-
static precautions be taken in the
handling and assembly of these
transceivers to prevent damage
which may be induced by
electrostatic discharge (ESD).
The HFBR-5320 transceiver
meets Mil-Std-883C Method
3015.4 Class 2.
Care should be used to avoid
shorting the receiver Data or
Status Flag Outputs directly to
ground without proper current
limiting impedance.
Figure 1. Block Diagram.
DATA OUT
DIFFERENTIAL
SIGNAL
DETECT OUT
DATA IN
ELECTRICAL SUBASSEMBLY
QUANTIZER IC
DRIVER IC
TOP VIEW
PIN
PHOTODIODE
DUPLEX
RECEPTACLE
OPTICAL
SUBASSEMBLIES
LED
PREAMP
IC
DIFFERENTIAL
DIFFERENTIAL