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參數(shù)資料
| 型號： | HI1-0549-2 |
| 廠商： | Intersil |
| 文件頁數(shù)： | 17/24頁 |
| 文件大小： | 0K |
| 描述： | IC MULTIPLEXER DUAL 4X1 16CDIP |
| 標(biāo)準(zhǔn)包裝： | 25 |
| 功能： | 多路復(fù)用器 |
| 電路： | 2 x 4:1 |
| 導(dǎo)通狀態(tài)電阻： | 1.5 千歐 |
| 電壓電源： | 雙電源 |
| 電壓 - 電源，單路/雙路(±)： | ±15V |
| 電流 - 電源： | 500µA |
| 工作溫度： | -55°C ~ 125°C |
| 安裝類型： | 通孔 |
| 封裝/外殼： | 16-CDIP（0.300"，7.62mm） |
| 供應(yīng)商設(shè)備封裝： | 16-CDIP |
| 包裝： | 管件 |
24
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
HI-546, HI-547, HI-548, HI-549
Plastic Leaded Chip Carrier Packages (PLCC)
A1
A
SEATING
PLANE
0.020 (0.51)
MIN
VIEW “A”
D2/E2
0.025 (0.64)
0.045 (1.14)
R
0.042 (1.07)
0.056 (1.42)
0.050 (1.27) TP
E
E1
0.042 (1.07)
0.048 (1.22)
PIN (1) IDENTIFIER
C
L
D1
D
0.020 (0.51) MAX
3 PLCS
0.026 (0.66)
0.032 (0.81)
0.045 (1.14)
MIN
0.013 (0.33)
0.021 (0.53)
0.025 (0.64)
MIN
VIEW “A” TYP.
0.004 (0.10)
C
-C-
D2/E2
C
L
NOTES:
1. Controlling dimension: INCH. Converted millimeter dimensions are
not necessarily exact.
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Allowable
mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1
and E1 include mold mismatch and are measured at the extreme
material condition at the body parting line.
4. To be measured at seating plane
contact point.
5. Centerline to be determined where center leads exit plastic body.
6. “N” is the number of terminal positions.
-C-
N20.35 (JEDEC MS-018AA ISSUE A)
20 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.165
0.180
4.20
4.57
-
A1
0.090
0.120
2.29
3.04
-
D
0.385
0.395
9.78
10.03
-
D1
0.350
0.356
8.89
9.04
3
D2
0.141
0.169
3.59
4.29
4, 5
E
0.385
0.395
9.78
10.03
-
E1
0.350
0.356
8.89
9.04
3
E2
0.141
0.169
3.59
4.29
4, 5
N20
20
6
Rev. 2 11/97
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| VI-JNM-IW-F3 | CONVERTER MOD DC/DC 10V 100W |
| HI4P0549-5Z | IC MULTIPLEXER DUAL 4X1 20PLCC |
| VE-B1V-CU-B1 | CONVERTER MOD DC/DC 5.8V 200W |
| VI-JNM-IW-F2 | CONVERTER MOD DC/DC 10V 100W |
| HI4P0506-5Z | IC MULTIPLEXER 16X1 28PLCC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HI1-0549-4 | 制造商:Harris Corporation 功能描述: |
| HI1-0549-5 | 制造商:Harris Corporation 功能描述: |
| HI1-0562AB0850-481 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HI1-0837-5 DIE | 制造商:Harris Corporation 功能描述: |
| HI1106 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:8-Bit, 35 MSPS, High Speed D/A Converter (TTL Input) |
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