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參數(shù)資料
| 型號： | HIN207ECB-T |
| 廠商： | Intersil |
| 文件頁數(shù)： | 7/22頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC 5DRVR/3RCVR RS232 5V 24-SOIC |
| 標準包裝： | 1,000 |
| 類型： | 收發(fā)器 |
| 驅(qū)動器/接收器數(shù)： | 5/3 |
| 規(guī)程： | RS232 |
| 電源電壓： | 4.75 V ~ 5.25 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 24-SOIC（0.295"，7.50mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 24-SOIC |
| 包裝： | 帶卷 (TR) |
15
FN4315.16
November 4, 2005
HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
INDEX
AREA
E
D
N
12
3
-B-
0.25(0.010)
C A
M
BS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45°
C
H
0.25(0.010)
B
M
α
M16.15 (JEDEC MS-012-AC ISSUE C)
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.3859
0.3937
9.80
10.00
3
E
0.1497
0.1574
3.80
4.00
4
e
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N16
16
7
α
0°
8°
0°
8°
-
Rev. 1 6/05
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HIN207ECB | IC 5DRVR/3RCVR RS232 5V 24-SOIC |
| HIN207ECA-T | IC 5DRVR/3RCVR RS232 5V 24-SSOP |
| HIN207CB-T | IC 5DRVR/3RCVR RS232 5V 24-SO |
| HIN207CB | IC 5DRVR/3RCVR RS232 5V 24-SO |
| HIN207CA | IC 5DRVR/3RCVR RS232 5V 24-SSOP |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HIN207ECBZ | 功能描述:RS-232接口集成電路 RS232 5V 5D/3R 15KV 24 COM RoHS:否 制造商:Exar 數(shù)據(jù)速率:52 Mbps 工作電源電壓:5 V 電源電流:300 mA 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:LQFP-100 封裝: |
| HIN207ECBZ-T | 功能描述:RS-232接口集成電路 RS232 5V 5D/3R 15KV 24 COM RoHS:否 制造商:Exar 數(shù)據(jù)速率:52 Mbps 工作電源電壓:5 V 電源電流:300 mA 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:LQFP-100 封裝: |
| HIN207ECP | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HIN207EIA | 制造商:Rochester Electronics LLC 功能描述:RS232 5V 5D/3R 15KV 24SSOP IND - Bulk |
| HIN207EIA-T | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
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